TY - GEN
T1 - Optical interconnection between III-V chips on Si by using photonic wire bonding
AU - Gu, Zhichen
AU - Amemiya, Tomohiro
AU - Ishikawa, Atsushi
AU - Hiratani, Takuo
AU - Suzuki, Junichi
AU - Nishiyama, Nobuhiko
AU - Tanaka, Takuo
AU - Arai, Shigehisa
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2015/5/29
Y1 - 2015/5/29
N2 - We connected two III-V laser and photodiode chips on Si substrate by using three-dimensional polymeric wires based on two-photon polymerization. We achieved an enhancement of the transmitting efficiency through PWB compare to the free-space transmission.
AB - We connected two III-V laser and photodiode chips on Si substrate by using three-dimensional polymeric wires based on two-photon polymerization. We achieved an enhancement of the transmitting efficiency through PWB compare to the free-space transmission.
UR - http://www.scopus.com/inward/record.url?scp=84936980653&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84936980653&partnerID=8YFLogxK
U2 - 10.1109/OIC.2015.7115715
DO - 10.1109/OIC.2015.7115715
M3 - Conference contribution
AN - SCOPUS:84936980653
T3 - 2015 IEEE Optical Interconnects Conference, OI 2015
SP - 120
EP - 121
BT - 2015 IEEE Optical Interconnects Conference, OI 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2015 IEEE Optical Interconnects Conference, OI 2015
Y2 - 20 April 2015 through 22 April 2015
ER -