Microscopic deformation of polycrystalline pure copper wire during tension

Naoya Tada, Yoshitaka Matsukawa, Takeshi Uemori, Toshiya Nakata

研究成果

5 被引用数 (Scopus)

抄録

In order to clarify the inhomogeneous deformation of thin copper wire, an interrupted tensile test was carried out on the stage of the digital holographic microscope (DHM). The inhomogeneity was evaluated based on the non-uniform change in height distribution on the surface of thin wire specimen during the test. Microscopic plastic deformation by a unit of crystal grain and large gradient in height distribution along grain boundaries were observed. The increase in average height of grain between two earlier loading steps corresponded to that between two later loading steps. This result suggests that the microscopic deformation at the latter stage of tension is predictable from that at the early stage of the tension.

本文言語English
ホスト出版物のタイトル2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings
出版社Institute of Electrical and Electronics Engineers Inc.
ページ229-232
ページ数4
ISBN(印刷版)9781467383561
DOI
出版ステータスPublished - 12月 23 2015
イベント10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Taipei
継続期間: 10月 21 201510月 23 2015

Other

Other10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015
国/地域Taiwan, Province of China
CityTaipei
Period10/21/1510/23/15

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 電子工学および電気工学

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