抄録
In order to clarify the inhomogeneous deformation of thin copper wire, an interrupted tensile test was carried out on the stage of the digital holographic microscope (DHM). The inhomogeneity was evaluated based on the non-uniform change in height distribution on the surface of thin wire specimen during the test. Microscopic plastic deformation by a unit of crystal grain and large gradient in height distribution along grain boundaries were observed. The increase in average height of grain between two earlier loading steps corresponded to that between two later loading steps. This result suggests that the microscopic deformation at the latter stage of tension is predictable from that at the early stage of the tension.
本文言語 | English |
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ホスト出版物のタイトル | 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings |
出版社 | Institute of Electrical and Electronics Engineers Inc. |
ページ | 229-232 |
ページ数 | 4 |
ISBN(印刷版) | 9781467383561 |
DOI | |
出版ステータス | Published - 12月 23 2015 |
イベント | 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Taipei 継続期間: 10月 21 2015 → 10月 23 2015 |
Other
Other | 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 |
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国/地域 | Taiwan, Province of China |
City | Taipei |
Period | 10/21/15 → 10/23/15 |
ASJC Scopus subject areas
- 電子材料、光学材料、および磁性材料
- 電子工学および電気工学