Verification of the Reduction of the Copper Loss by the Thin Coil Structure for Induction Cookers

Morimasa Hataya, Koki Kamaeguchi, Eiji Hiraki, Kazuhiro Umetani, Takayuki Hirokawa, Makoto Imai, Hideki Sadakata

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

Litz wire is commonly employed as the heating coil of induction cookers. In order to realize further low cost and profile, the solid wire with simple construction and high space factor is required. However, the solid wire is may suffer from the large copper loss increased by the skin and proximity effect. Then, the previous study proposed the novel coil structure, which can suppress these effects, only by the FEM simulation. Therefore, the purpose of this paper is to verify this structure experimentally in comparison with the Litz wire coil. The result revealed that the proposed structure can have similar AC resistance and the similar height with the same surface area and the same number of turns. Moreover, the experimental result showed a possibility to further height reduction by optimization of the magnetic and winding isolation design. Consequently, the experiment supported practical effectiveness of the proposed structure for induction heating.

Original languageEnglish
Title of host publication2018 International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages410-415
Number of pages6
ISBN (Electronic)9784886864055
DOIs
Publication statusPublished - Oct 22 2018
Event8th International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018 - Niigata, Japan
Duration: May 20 2018May 24 2018

Other

Other8th International Power Electronics Conference, IPEC-Niigata - ECCE Asia 2018
Country/TerritoryJapan
CityNiigata
Period5/20/185/24/18

Keywords

  • copper loss
  • foil wire
  • induction cooker
  • proximity effect

ASJC Scopus subject areas

  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering

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