Universal three-dimensional nanofabrication for hard materials

Kenji Yamazaki, Hiroshi Yamaguchi

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

Three-dimensional (3D) nanofabrication technologies are entering new phases in advanced application fields, such as nanorobotics, metamaterials, and nanomechanical systems. In particular, the ability to arbitrarily create 3D nanostructures in hard materials like semiconductors and metals with nanometer-scale resolution will accelerate innovation in these fields, although a versatile technology applicable to various materials has not yet been established. The authors have devised a flexible 3D nanofabrication technique that is applicable to any material in principle. It uses 3D electron beam (EB) writing of arbitrary patterns followed by 3D ion etching, where the EB and ions fly in directions vertical and parallel to the substrate surface. Characteristics of the etching angle were investigated, and large angled etching of 88° was achieved. 3D nanostructures fabricated in single-crystal Si demonstrate that this technique has high resolution, high fabrication speed, and a large degree of freedom in the 3D shapes and dimensions that can be realized.

Original languageEnglish
Article number051802
JournalJournal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Volume31
Issue number5
DOIs
Publication statusPublished - Sep 2013
Externally publishedYes

Fingerprint

nanofabrication
Nanotechnology
Etching
etching
Electron beams
Nanostructures
Nanorobotics
electron beams
Metamaterials
Ions
Degrees of freedom (mechanics)
ions
degrees of freedom
Innovation
Single crystals
Semiconductor materials
Fabrication
fabrication
high resolution
single crystals

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this

Universal three-dimensional nanofabrication for hard materials. / Yamazaki, Kenji; Yamaguchi, Hiroshi.

In: Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, Vol. 31, No. 5, 051802, 09.2013.

Research output: Contribution to journalArticle

@article{7b84172d16cb46269bab4a774d4f7afc,
title = "Universal three-dimensional nanofabrication for hard materials",
abstract = "Three-dimensional (3D) nanofabrication technologies are entering new phases in advanced application fields, such as nanorobotics, metamaterials, and nanomechanical systems. In particular, the ability to arbitrarily create 3D nanostructures in hard materials like semiconductors and metals with nanometer-scale resolution will accelerate innovation in these fields, although a versatile technology applicable to various materials has not yet been established. The authors have devised a flexible 3D nanofabrication technique that is applicable to any material in principle. It uses 3D electron beam (EB) writing of arbitrary patterns followed by 3D ion etching, where the EB and ions fly in directions vertical and parallel to the substrate surface. Characteristics of the etching angle were investigated, and large angled etching of 88° was achieved. 3D nanostructures fabricated in single-crystal Si demonstrate that this technique has high resolution, high fabrication speed, and a large degree of freedom in the 3D shapes and dimensions that can be realized.",
author = "Kenji Yamazaki and Hiroshi Yamaguchi",
year = "2013",
month = "9",
doi = "10.1116/1.4817177",
language = "English",
volume = "31",
journal = "Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures",
issn = "1071-1023",
publisher = "AVS Science and Technology Society",
number = "5",

}

TY - JOUR

T1 - Universal three-dimensional nanofabrication for hard materials

AU - Yamazaki, Kenji

AU - Yamaguchi, Hiroshi

PY - 2013/9

Y1 - 2013/9

N2 - Three-dimensional (3D) nanofabrication technologies are entering new phases in advanced application fields, such as nanorobotics, metamaterials, and nanomechanical systems. In particular, the ability to arbitrarily create 3D nanostructures in hard materials like semiconductors and metals with nanometer-scale resolution will accelerate innovation in these fields, although a versatile technology applicable to various materials has not yet been established. The authors have devised a flexible 3D nanofabrication technique that is applicable to any material in principle. It uses 3D electron beam (EB) writing of arbitrary patterns followed by 3D ion etching, where the EB and ions fly in directions vertical and parallel to the substrate surface. Characteristics of the etching angle were investigated, and large angled etching of 88° was achieved. 3D nanostructures fabricated in single-crystal Si demonstrate that this technique has high resolution, high fabrication speed, and a large degree of freedom in the 3D shapes and dimensions that can be realized.

AB - Three-dimensional (3D) nanofabrication technologies are entering new phases in advanced application fields, such as nanorobotics, metamaterials, and nanomechanical systems. In particular, the ability to arbitrarily create 3D nanostructures in hard materials like semiconductors and metals with nanometer-scale resolution will accelerate innovation in these fields, although a versatile technology applicable to various materials has not yet been established. The authors have devised a flexible 3D nanofabrication technique that is applicable to any material in principle. It uses 3D electron beam (EB) writing of arbitrary patterns followed by 3D ion etching, where the EB and ions fly in directions vertical and parallel to the substrate surface. Characteristics of the etching angle were investigated, and large angled etching of 88° was achieved. 3D nanostructures fabricated in single-crystal Si demonstrate that this technique has high resolution, high fabrication speed, and a large degree of freedom in the 3D shapes and dimensions that can be realized.

UR - http://www.scopus.com/inward/record.url?scp=84884950505&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84884950505&partnerID=8YFLogxK

U2 - 10.1116/1.4817177

DO - 10.1116/1.4817177

M3 - Article

AN - SCOPUS:84884950505

VL - 31

JO - Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

JF - Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

SN - 1071-1023

IS - 5

M1 - 051802

ER -