Ultra compact RFICs using three-dimensional MMIC technology

Takana Kaho, Yo Yamaguchi, Kenjiro Nishikawa, Ichihiko Toyoda, Kazuhiro Uehara

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Since the 1980s, NTT has been developing threedimensional (3D) monolith microwave integrated circuits (MMICs) to achieve small-size and low-cost ICs. The usage of 3D MMICs is a very powerful technique, especially at quasimillimeter and millimeter wave levels. We describe the structure and features of 3D MMICs, introduce several MMIC subsystems, and point out future directions and plans for using 3D MMICs.

Original languageEnglish
Title of host publication2010 IEEE MTT-S International Microwave Symposium, MTT 2010
Pages1304-1307
Number of pages4
DOIs
Publication statusPublished - Oct 15 2010
Externally publishedYes
Event2010 IEEE MTT-S International Microwave Symposium, MTT 2010 - Anaheim, CA, United States
Duration: May 23 2010May 28 2010

Publication series

NameIEEE MTT-S International Microwave Symposium Digest
ISSN (Print)0149-645X

Other

Other2010 IEEE MTT-S International Microwave Symposium, MTT 2010
CountryUnited States
CityAnaheim, CA
Period5/23/105/28/10

Keywords

  • Balun
  • Directional coupler
  • High Q inductor
  • Stacked inductor
  • Three-dimensional MMIC
  • Transceiver

ASJC Scopus subject areas

  • Radiation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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