Tomographic image analysis for detection of defects at BGA

T. Sumimoto, T. Maruyama, Y. Azuma, S. Goto, M. Mondou, N. Furukawa, S. Okada

Research output: Contribution to conferencePaper

Abstract

This paper presents an image analysis for detection of defects at BGA. We attempt to detect the characteristics of the defects at BGA based on an image analysis. Using the X-ray penetration equipment, we have captured images of an IC package to search an abnormal BGA. Besides, in order to get information in detail of an abnormal BGA, we tried to capture the tomographic images utilizing the latest imaging techniques. The problems of image analysis for the detection of defects at BGA solder joints are the detection accuracy and image processing time according to a line speed of production. To get design data for the development of the inspection system, which can be used easily in the surface mount process, it is important to develop image analysis techniques based on the X-ray image data.

Original languageEnglish
Pages3329-3334
Number of pages6
Publication statusPublished - Dec 1 2005
EventSICE Annual Conference 2005 - Okayama, Japan
Duration: Aug 8 2005Aug 10 2005

Other

OtherSICE Annual Conference 2005
CountryJapan
CityOkayama
Period8/8/058/10/05

Keywords

  • Ball Grid Array
  • Image analysis
  • Tomography
  • X-ray

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Computer Science Applications
  • Electrical and Electronic Engineering

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  • Cite this

    Sumimoto, T., Maruyama, T., Azuma, Y., Goto, S., Mondou, M., Furukawa, N., & Okada, S. (2005). Tomographic image analysis for detection of defects at BGA. 3329-3334. Paper presented at SICE Annual Conference 2005, Okayama, Japan.