Time-dependent fracture of copper-cored lead-free solder ball and nickel rod joints in air, distilled water, and NaCl solution

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Solder joints have been used for electric connections in many electronic devices, and the joints are subjected to mechanical loadings such as static or cyclic tension/compression and shearing under various environments. Since the melting point of solder is very low comparing with the other normal metals, the time-dependent damage accumulation and fracture are often found in the solders even at the room temperature. In this paper, tensile tests of copper-cored lead-free solder ball and nickel rod joints were carried out in air, distilled water, and salt water environments using a unique testing device with permanent magnet. The time-dependent fracture of the joints was investigated from the viewpoint of damage accumulation.

Original languageEnglish
Title of host publicationIMPACT 2017 - 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceedings
PublisherIEEE Computer Society
Pages168-171
Number of pages4
Volume2017-October
ISBN (Electronic)9781538647196
DOIs
Publication statusPublished - Jan 12 2018
Event12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2017 - Taipei, Taiwan, Province of China
Duration: Oct 25 2017Oct 27 2017

Other

Other12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2017
CountryTaiwan, Province of China
CityTaipei
Period10/25/1710/27/17

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ASJC Scopus subject areas

  • Hardware and Architecture
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Tada, N., & Uemori, T. (2018). Time-dependent fracture of copper-cored lead-free solder ball and nickel rod joints in air, distilled water, and NaCl solution. In IMPACT 2017 - 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceedings (Vol. 2017-October, pp. 168-171). IEEE Computer Society. https://doi.org/10.1109/IMPACT.2017.8255911