Three-dimensional resist-coating technique and nanopatterning on a cube using electron-beam lithography and etching

Kenji Yamazaki, Hideo Namatsu

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

A new resist-coating technique for three-dimensional substrates keeps a substrate in a quasi-static ambient of very fine mist of resist solution, so that a resist can be uniformly coated on each face of the substrate. We found that the temperature of the substrate has to be carefully controlled to obtain a smooth resist surface. A polymethylmethacrylate resist was coated with good uniformity on an oxidized Si cube, and patterns delineated on different faces by electron-beam lithography were similar. The resolution was confirmed to be 50 nm or less by observing dense line patterns etched in the oxide film on the cube.

Original languageEnglish
JournalJapanese Journal of Applied Physics, Part 2: Letters
Volume45
Issue number12-16
DOIs
Publication statusPublished - 2006
Externally publishedYes

Fingerprint

Coating techniques
Electron beam lithography
coating
Etching
lithography
etching
electron beams
Substrates
mist
Fog
Oxide films
oxide films
Temperature
temperature

Keywords

  • 3D
  • EB nanolithography
  • PMMA
  • Resist coating
  • Silicon cube

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

Cite this

Three-dimensional resist-coating technique and nanopatterning on a cube using electron-beam lithography and etching. / Yamazaki, Kenji; Namatsu, Hideo.

In: Japanese Journal of Applied Physics, Part 2: Letters, Vol. 45, No. 12-16, 2006.

Research output: Contribution to journalArticle

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