Three-dimensional resist-coating technique and nanopatterning on a cube using electron-beam lithography and etching

Kenji Yamazaki, Hideo Namatsu

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

A new resist-coating technique for three-dimensional substrates keeps a substrate in a quasi-static ambient of very fine mist of resist solution, so that a resist can be uniformly coated on each face of the substrate. We found that the temperature of the substrate has to be carefully controlled to obtain a smooth resist surface. A polymethylmethacrylate resist was coated with good uniformity on an oxidized Si cube, and patterns delineated on different faces by electron-beam lithography were similar. The resolution was confirmed to be 50 nm or less by observing dense line patterns etched in the oxide film on the cube.

Original languageEnglish
Pages (from-to)L403-L405
JournalJapanese Journal of Applied Physics, Part 2: Letters
Volume45
Issue number12-16
DOIs
Publication statusPublished - May 17 2006

Keywords

  • 3D
  • EB nanolithography
  • PMMA
  • Resist coating
  • Silicon cube

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy (miscellaneous)
  • Physics and Astronomy(all)

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