Abstract
A new technique for fabricating three-dimensional (3D) nanostructures enables us to create various 3D nanodevices. The technique involves using electron beam (EB) writing from various directions on microstructures. New methods of resist coating on microstructures and etching parallel to the substrate surface make it possible to apply the 3D-EB writing to 3D nanofabrication in various materials, including Si and hard materials. This technique was used to create 3D Si nanostructures at high resolution and with a high fabrication speed and large arbitrariness in the types of 3D structures that can be created. The technique is therefore promising for creating 3D nanodevices in various nanotechnology fields such as nanomechanics and metamaterials.
| Original language | English |
|---|---|
| Journal | NTT Technical Review |
| Volume | 12 |
| Issue number | 2 |
| Publication status | Published - Feb 2014 |
| Externally published | Yes |
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Keywords
- 3D nanostructure
- EB writing
- Nanomechanical device
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Computer Networks and Communications
- Computer Science Applications
Cite this
Three-dimensional nanofabrication in si using electron beam lithography. / Yamazaki, Kenji; Yamaguchi, Hiroshi.
In: NTT Technical Review, Vol. 12, No. 2, 02.2014.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Three-dimensional nanofabrication in si using electron beam lithography
AU - Yamazaki, Kenji
AU - Yamaguchi, Hiroshi
PY - 2014/2
Y1 - 2014/2
N2 - A new technique for fabricating three-dimensional (3D) nanostructures enables us to create various 3D nanodevices. The technique involves using electron beam (EB) writing from various directions on microstructures. New methods of resist coating on microstructures and etching parallel to the substrate surface make it possible to apply the 3D-EB writing to 3D nanofabrication in various materials, including Si and hard materials. This technique was used to create 3D Si nanostructures at high resolution and with a high fabrication speed and large arbitrariness in the types of 3D structures that can be created. The technique is therefore promising for creating 3D nanodevices in various nanotechnology fields such as nanomechanics and metamaterials.
AB - A new technique for fabricating three-dimensional (3D) nanostructures enables us to create various 3D nanodevices. The technique involves using electron beam (EB) writing from various directions on microstructures. New methods of resist coating on microstructures and etching parallel to the substrate surface make it possible to apply the 3D-EB writing to 3D nanofabrication in various materials, including Si and hard materials. This technique was used to create 3D Si nanostructures at high resolution and with a high fabrication speed and large arbitrariness in the types of 3D structures that can be created. The technique is therefore promising for creating 3D nanodevices in various nanotechnology fields such as nanomechanics and metamaterials.
KW - 3D nanostructure
KW - EB writing
KW - Nanomechanical device
UR - http://www.scopus.com/inward/record.url?scp=84894317691&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84894317691&partnerID=8YFLogxK
M3 - Article
AN - SCOPUS:84894317691
VL - 12
JO - NTT Technical Review
JF - NTT Technical Review
SN - 1348-3447
IS - 2
ER -