Thermal stress analysis and the sealing performance evaluation of bolted flange connection at elevated temperature

Yuya Omiya, Toshiyuki Sawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Citations (Scopus)

Abstract

In designing bolted flange connections under heat conduction conditions and internal pressure, the characteristics such as the contact gasket stress are important factors from reliable design standpoint. They must be examined analytically and experimentally. In this paper, in order to examine the above characteristics, thermal stress of bolted flange connections subjected to internal pressure and heat conduction conditions is analyzed using the theory of elasticity and FEM calculations. The effects of gasket properties and nominal diameter of flanges on the above characteristics are examined numerically. In the experiments, the amount of helium gas leakage in the connection was measured. Using the obtained gasket stress at elevated temperature, a method for estimating the amount of gas leakage is proposed. The analytical results of the above characteristics are compared with the experimental results, with reasonable agreements. The results reveal that the sealing performance increases due to the gasket properties as the temperature increases in this study.

Original languageEnglish
Title of host publicationAmerican Society of Mechanical Engineers, Pressure Vessels and Piping Division (Publication) PVP
Pages397-408
Number of pages12
Volume5
DOIs
Publication statusPublished - 2010
Externally publishedYes
Event2009 ASME Pressure Vessels and Piping Conference, PVP 2009 - Prague, Czech Republic
Duration: Jul 26 2009Jul 30 2009

Other

Other2009 ASME Pressure Vessels and Piping Conference, PVP 2009
CountryCzech Republic
CityPrague
Period7/26/097/30/09

Fingerprint

Flanges
Stress analysis
Thermal stress
Leakage (fluid)
Heat conduction
Gases
Temperature
Helium
Elasticity
Finite element method
Experiments

ASJC Scopus subject areas

  • Mechanical Engineering

Cite this

Omiya, Y., & Sawa, T. (2010). Thermal stress analysis and the sealing performance evaluation of bolted flange connection at elevated temperature. In American Society of Mechanical Engineers, Pressure Vessels and Piping Division (Publication) PVP (Vol. 5, pp. 397-408) https://doi.org/10.1115/PVP2009-77464

Thermal stress analysis and the sealing performance evaluation of bolted flange connection at elevated temperature. / Omiya, Yuya; Sawa, Toshiyuki.

American Society of Mechanical Engineers, Pressure Vessels and Piping Division (Publication) PVP. Vol. 5 2010. p. 397-408.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Omiya, Y & Sawa, T 2010, Thermal stress analysis and the sealing performance evaluation of bolted flange connection at elevated temperature. in American Society of Mechanical Engineers, Pressure Vessels and Piping Division (Publication) PVP. vol. 5, pp. 397-408, 2009 ASME Pressure Vessels and Piping Conference, PVP 2009, Prague, Czech Republic, 7/26/09. https://doi.org/10.1115/PVP2009-77464
Omiya Y, Sawa T. Thermal stress analysis and the sealing performance evaluation of bolted flange connection at elevated temperature. In American Society of Mechanical Engineers, Pressure Vessels and Piping Division (Publication) PVP. Vol. 5. 2010. p. 397-408 https://doi.org/10.1115/PVP2009-77464
Omiya, Yuya ; Sawa, Toshiyuki. / Thermal stress analysis and the sealing performance evaluation of bolted flange connection at elevated temperature. American Society of Mechanical Engineers, Pressure Vessels and Piping Division (Publication) PVP. Vol. 5 2010. pp. 397-408
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