The silicon vertex detector of the Belle II experiment

Belle II SVD collaboration

Research output: Contribution to journalArticle

11 Citations (Scopus)

Abstract

The silicon vertex detector of the Belle II experiment, structured in a lantern shape, consists of four layers of ladders, fabricated from two to five silicon sensors. The APV25 readout ASIC chips are mounted on one side of the ladder to minimize the signal path for reducing the capacitive noise; signals from the sensor backside are transmitted to the chip by bent flexible fan-out circuits. The ladder is assembled using several dedicated jigs. Sensor motion on the jig is minimized by vacuum chucking. The gluing procedure provides such a rigid foundation that later leads to the desired wire bonding performance. The full ladder with electrically functional sensors is consistently completed with a fully developed assembly procedure, and its sensor offsets from the design values are found to be less than 200 μm. The potential functionality of the ladder is also demonstrated by the radioactive source test.

Original languageEnglish
Pages (from-to)406-410
Number of pages5
JournalNuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
Volume824
DOIs
Publication statusPublished - Jul 11 2016
Externally publishedYes

Fingerprint

Silicon detectors
Ladders
ladders
apexes
jigs
sensors
detectors
silicon
Jigs
Sensors
Experiments
chips
Silicon sensors
Gluing
application specific integrated circuits
Application specific integrated circuits
fans
Fans
readout
assembly

Keywords

  • B Factory experiment
  • Belle II
  • Silicon vertex detector

ASJC Scopus subject areas

  • Instrumentation
  • Nuclear and High Energy Physics

Cite this

The silicon vertex detector of the Belle II experiment. / Belle II SVD collaboration.

In: Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, Vol. 824, 11.07.2016, p. 406-410.

Research output: Contribution to journalArticle

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abstract = "The silicon vertex detector of the Belle II experiment, structured in a lantern shape, consists of four layers of ladders, fabricated from two to five silicon sensors. The APV25 readout ASIC chips are mounted on one side of the ladder to minimize the signal path for reducing the capacitive noise; signals from the sensor backside are transmitted to the chip by bent flexible fan-out circuits. The ladder is assembled using several dedicated jigs. Sensor motion on the jig is minimized by vacuum chucking. The gluing procedure provides such a rigid foundation that later leads to the desired wire bonding performance. The full ladder with electrically functional sensors is consistently completed with a fully developed assembly procedure, and its sensor offsets from the design values are found to be less than 200 μm. The potential functionality of the ladder is also demonstrated by the radioactive source test.",
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AU - Belle II SVD collaboration

AU - Adamczyk, K.

AU - Aihara, H.

AU - Angelini, C.

AU - Aziz, T.

AU - Babu, V.

AU - Bacher, S.

AU - Bahinipati, S.

AU - Barberio, E.

AU - Baroncelli, T.

AU - Basith, A. K.

AU - Batignani, G.

AU - Bauer, A.

AU - Behera, P. K.

AU - Bergauer, T.

AU - Bettarini, S.

AU - Bhuyan, B.

AU - Bilka, T.

AU - Bosi, F.

AU - Bosisio, L.

AU - Bozek, A.

AU - Buchsteiner, F.

AU - Casarosa, G.

AU - Ceccanti, M.

AU - Červenkov, D.

AU - Chendvankar, S. R.

AU - Dash, N.

AU - Divekar, S. T.

AU - Doležal, Z.

AU - Dutta, D.

AU - Forti, F.

AU - Friedl, M.

AU - Hara, K.

AU - Higuchi, T.

AU - Horiguchi, T.

AU - Irmler, C.

AU - Ishikawa, A.

AU - Jeon, H. B.

AU - Joo, C. W.

AU - Kandra, J.

AU - Kang, K. H.

AU - Kato, E.

AU - Kawasaki, T.

AU - Kodyš, P.

AU - Kohriki, T.

AU - Koike, S.

AU - Kolwalkar, M. M.

AU - Kvasnička, P.

AU - Lanceri, L.

AU - Lettenbicher, J.

AU - Uozumi, Satoru

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N2 - The silicon vertex detector of the Belle II experiment, structured in a lantern shape, consists of four layers of ladders, fabricated from two to five silicon sensors. The APV25 readout ASIC chips are mounted on one side of the ladder to minimize the signal path for reducing the capacitive noise; signals from the sensor backside are transmitted to the chip by bent flexible fan-out circuits. The ladder is assembled using several dedicated jigs. Sensor motion on the jig is minimized by vacuum chucking. The gluing procedure provides such a rigid foundation that later leads to the desired wire bonding performance. The full ladder with electrically functional sensors is consistently completed with a fully developed assembly procedure, and its sensor offsets from the design values are found to be less than 200 μm. The potential functionality of the ladder is also demonstrated by the radioactive source test.

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KW - B Factory experiment

KW - Belle II

KW - Silicon vertex detector

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JO - Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

JF - Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

SN - 0168-9002

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