Tensile test of small lead-free solder joint using permanent magnet

Naoya Tada, Ryo Nishihara, Hiroyasu Masago

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Since solder materials are often used for electric connections in various electric devices, the strength of solders and that of interfaces to the other metallic materials are very important. After the restriction of lead solder usage according to the European Union Waste Electrical and Electronic Equipment (WEEE) and Restriction of Hazardous Substances (RoHS) Directives, various lead-free solders have been developed and their optimized joining condition is being investigated. The mechanical test of solder joints is one of the best ways to check the joining condition and it gives us useful information to secure the safety of electric devices. From the viewpoint of mechanical testing, it is not easy to handle the solder materials because of their very low deformation resistance and small size. In this paper, a new method of tensile test is proposed using permanent magnet, and the results are discussed. By using the permanent magnet, various non-contact tensile tests are going to be possible. The present paper is a basic study to realize the non-contact tensile tests for micro materials.

Original languageEnglish
Title of host publicationProceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
Pages145-148
Number of pages4
DOIs
Publication statusPublished - 2012
Event2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012 - Taipei, Taiwan, Province of China
Duration: Oct 24 2012Oct 26 2012

Other

Other2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012
CountryTaiwan, Province of China
CityTaipei
Period10/24/1210/26/12

Fingerprint

Soldering alloys
Permanent magnets
Joining
Mechanical testing
Electronic equipment
Lead
Lead-free solders

ASJC Scopus subject areas

  • Hardware and Architecture
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Tada, N., Nishihara, R., & Masago, H. (2012). Tensile test of small lead-free solder joint using permanent magnet. In Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT (pp. 145-148). [6420226] https://doi.org/10.1109/IMPACT.2012.6420226

Tensile test of small lead-free solder joint using permanent magnet. / Tada, Naoya; Nishihara, Ryo; Masago, Hiroyasu.

Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT. 2012. p. 145-148 6420226.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Tada, N, Nishihara, R & Masago, H 2012, Tensile test of small lead-free solder joint using permanent magnet. in Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT., 6420226, pp. 145-148, 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012, Taipei, Taiwan, Province of China, 10/24/12. https://doi.org/10.1109/IMPACT.2012.6420226
Tada N, Nishihara R, Masago H. Tensile test of small lead-free solder joint using permanent magnet. In Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT. 2012. p. 145-148. 6420226 https://doi.org/10.1109/IMPACT.2012.6420226
Tada, Naoya ; Nishihara, Ryo ; Masago, Hiroyasu. / Tensile test of small lead-free solder joint using permanent magnet. Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT. 2012. pp. 145-148
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