Tensile test of notched metal film by means of thermal expansion of plastics

Naoya Tada, Ichiro Shimizu, Kazumasa Uemori

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Tensile tests of notched thin film of pure titanium were carried out on the stage of a digital microscope. Tensile load was generated by the thermal expansion of a pair of polycarbonate loading plates which sandwiched the specimen. Since the thermal expansion coefficient of polycarbonate is much larger than that of pure titanium, the specimen was elongated with an increase in the temperature and successfully fractured at the end of the tensile test. The plastic deformation of the notched part of the specimen was observed during the test and the stress and strain were evaluated. The obtained stress-strain curves were compared with those obtained by a tensile testing device with a piezoelectric stage at the room temperature and 363 K which approximately corresponds to the maximum temperature of the thermal stress-actuated tensile test.

Original languageEnglish
Title of host publicationEMAP 2007- International Conference on Electronic Materials and Packaging 2007
DOIs
Publication statusPublished - Dec 1 2007
EventInternational Conference on Electronic Materials and Packaging 2007, EMAP 2007 - Daejeon, Korea, Republic of
Duration: Nov 19 2007Nov 22 2007

Publication series

NameEMAP 2007 - International Conference on Electronic Materials and Packaging 2007

Other

OtherInternational Conference on Electronic Materials and Packaging 2007, EMAP 2007
CountryKorea, Republic of
CityDaejeon
Period11/19/0711/22/07

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Tada, N., Shimizu, I., & Uemori, K. (2007). Tensile test of notched metal film by means of thermal expansion of plastics. In EMAP 2007- International Conference on Electronic Materials and Packaging 2007 [4510292] (EMAP 2007 - International Conference on Electronic Materials and Packaging 2007). https://doi.org/10.1109/EMAP.2007.4510292