TY - GEN
T1 - Tensile test of notched metal film by means of thermal expansion of plastics
AU - Tada, Naoya
AU - Shimizu, Ichiro
AU - Uemori, Kazumasa
PY - 2007
Y1 - 2007
N2 - Tensile tests of notched thin film of pure titanium were carried out on the stage of a digital microscope. Tensile load was generated by the thermal expansion of a pair of polycarbonate loading plates which sandwiched the specimen. Since the thermal expansion coefficient of polycarbonate is much larger than that of pure titanium, the specimen was elongated with an increase in the temperature and successfully fractured at the end of the tensile test. The plastic deformation of the notched part of the specimen was observed during the test and the stress and strain were evaluated. The obtained stress-strain curves were compared with those obtained by a tensile testing device with a piezoelectric stage at the room temperature and 363 K which approximately corresponds to the maximum temperature of the thermal stress-actuated tensile test.
AB - Tensile tests of notched thin film of pure titanium were carried out on the stage of a digital microscope. Tensile load was generated by the thermal expansion of a pair of polycarbonate loading plates which sandwiched the specimen. Since the thermal expansion coefficient of polycarbonate is much larger than that of pure titanium, the specimen was elongated with an increase in the temperature and successfully fractured at the end of the tensile test. The plastic deformation of the notched part of the specimen was observed during the test and the stress and strain were evaluated. The obtained stress-strain curves were compared with those obtained by a tensile testing device with a piezoelectric stage at the room temperature and 363 K which approximately corresponds to the maximum temperature of the thermal stress-actuated tensile test.
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U2 - 10.1109/EMAP.2007.4510292
DO - 10.1109/EMAP.2007.4510292
M3 - Conference contribution
AN - SCOPUS:51249124454
SN - 1424419093
SN - 9781424419098
T3 - EMAP 2007 - International Conference on Electronic Materials and Packaging 2007
BT - EMAP 2007- International Conference on Electronic Materials and Packaging 2007
T2 - International Conference on Electronic Materials and Packaging 2007, EMAP 2007
Y2 - 19 November 2007 through 22 November 2007
ER -