Supercritical resist dryer

Hideo Namatsu, Kenji Yamazaki, Kenji Kurihara

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Abstract

A supercritical resist dryer (SRD) based on supercritical (SC) drying by controlling moisture is developed. It was effective to dry using SC CO 2 at a lower pressure just above the critical point, and adding a pumping system of SC CO 2 to the Teflon-coated chamber to reduce water contamination. The SRD yielded high-aspect-ratio resist patterns without any pattern collapse or deformation.

Original languageEnglish
Pages (from-to)780-784
Number of pages5
JournalJournal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Volume18
Issue number2
DOIs
Publication statusPublished - Mar 2000
Externally publishedYes

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ASJC Scopus subject areas

  • Engineering(all)

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