Study of gluing and wire bonding for the Belle II Silicon Vertex Detector

K. H. Kang, K. Hara, T. Higuchi, H. J. Hyun, H. B. Jeon, C. W. Joo, D. H. Kah, H. J. Kim, T. Mibe, Y. Onuki, H. Park, K. K. Rao, N. Sato, N. Shimizu, K. Tanida, T. Tsuboyama, Satoru Uozumi

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

This paper describes an investigation into gluing and wire bonding for assembling the Silicon Vertex Detector (SVD) for the Belle II experiment at KEK in Japan. Optimizing the gluing of the silicon microstrip sensors, the support frame, and the readout flex cables is important for achieving the required mechanical precision. The wire bonding between the sensors and the readout electronic chips also needs special care to maximize the physics capability of the SVD. The silicon sensors and signal fan out flex circuits (pitch adapters) are glued and connected using wire bonding. We determine that gluing quality is important for achieving good bonding efficiency. The standard deviation in the glue thickness for the best result is measured to be 3.11 μm. Optimal machine parameters for wire bonding are determined to be 70 mW power, 20 gf force, and 20 ms for the pitch adapter and 60 mW power, 20 gf force, and 20 ms for the silicon strip sensors; these parameters provide a pull force of (10.92±0.72) gf. With these settings, 75% of the pitch adapters and 25% of the strip sensors experience the neck-broken type of break.

Original languageEnglish
Pages (from-to)255-259
Number of pages5
JournalNuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
Volume763
DOIs
Publication statusPublished - Nov 1 2014
Externally publishedYes

Fingerprint

Gluing
Silicon detectors
apexes
adapters
wire
Wire
sensors
detectors
silicon
Sensors
readout
strip
chips (electronics)
Silicon sensors
Silicon
glues
Glues
assembling
fans
cables

Keywords

  • Belle II
  • Gluing
  • Pitch adapter
  • Silicon sensor
  • Silicon Vertex Detector
  • Wire bonding

ASJC Scopus subject areas

  • Instrumentation
  • Nuclear and High Energy Physics

Cite this

Study of gluing and wire bonding for the Belle II Silicon Vertex Detector. / Kang, K. H.; Hara, K.; Higuchi, T.; Hyun, H. J.; Jeon, H. B.; Joo, C. W.; Kah, D. H.; Kim, H. J.; Mibe, T.; Onuki, Y.; Park, H.; Rao, K. K.; Sato, N.; Shimizu, N.; Tanida, K.; Tsuboyama, T.; Uozumi, Satoru.

In: Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, Vol. 763, 01.11.2014, p. 255-259.

Research output: Contribution to journalArticle

Kang, KH, Hara, K, Higuchi, T, Hyun, HJ, Jeon, HB, Joo, CW, Kah, DH, Kim, HJ, Mibe, T, Onuki, Y, Park, H, Rao, KK, Sato, N, Shimizu, N, Tanida, K, Tsuboyama, T & Uozumi, S 2014, 'Study of gluing and wire bonding for the Belle II Silicon Vertex Detector', Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, vol. 763, pp. 255-259. https://doi.org/10.1016/j.nima.2014.06.053
Kang, K. H. ; Hara, K. ; Higuchi, T. ; Hyun, H. J. ; Jeon, H. B. ; Joo, C. W. ; Kah, D. H. ; Kim, H. J. ; Mibe, T. ; Onuki, Y. ; Park, H. ; Rao, K. K. ; Sato, N. ; Shimizu, N. ; Tanida, K. ; Tsuboyama, T. ; Uozumi, Satoru. / Study of gluing and wire bonding for the Belle II Silicon Vertex Detector. In: Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment. 2014 ; Vol. 763. pp. 255-259.
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