Singulation of semiconductor package by superposition of pulsed fiber laser and green yag laser

Yasuhiro Okamoto, Kento Shirasaya, Ryoji Kitada, Akira Okada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The application of laser beam processing has been expected in the field of semiconductor devices because of its flexible cutting line and narrow kerf width. However, the deterioration of cutting quality would occur in the case of themosensitive materials due to the thermal damage, since the laser beam processing is mainly thermal process. Therefore, the laser singulation method by the superposition of pulsed fiber laser and green YAG laser was proposed to perform the high-quality processing for the semiconductor package, which is consisted of thermosetting epoxyresin with silica for molding compounds and glass epoxy board for semiconductor package with insulator coatings. The superposition of pulsed fiber laser and green YAG laser with high pulse repetition rates led to a straighter kerf shape with smaller kerf width under the same pulse energy condition. The smaller kerf width could be achieved by controlling the time delay between both laser pulses compared with synchronized laser pulses. The heat affected zone in singulation process could be reduced by the superposition of pulsed fiber laser and green YAG laser. Moreover, the synchronized laser pulses could lead to the smaller heat affected zone compared with unsynchronized one.

Original languageEnglish
Title of host publicationICALEO 2013 - 32nd International Congress on Applications of Lasers and Electro-Optics
Pages829-835
Number of pages7
Publication statusPublished - 2013
Event32nd International Congress on Applications of Lasers and Electro-Optics, ICALEO 2013 - Miami, FL, United States
Duration: Oct 6 2013Oct 10 2013

Other

Other32nd International Congress on Applications of Lasers and Electro-Optics, ICALEO 2013
CountryUnited States
CityMiami, FL
Period10/6/1310/10/13

Fingerprint

Fiber lasers
Pulsed lasers
Semiconductor materials
Laser pulses
Lasers
Heat affected zone
Laser beams
Processing
Pulse repetition rate
Sheet molding compounds
Semiconductor devices
Silicon Dioxide
Deterioration
Time delay
Silica
Glass
Coatings
Hot Temperature

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Cite this

Okamoto, Y., Shirasaya, K., Kitada, R., & Okada, A. (2013). Singulation of semiconductor package by superposition of pulsed fiber laser and green yag laser. In ICALEO 2013 - 32nd International Congress on Applications of Lasers and Electro-Optics (pp. 829-835)

Singulation of semiconductor package by superposition of pulsed fiber laser and green yag laser. / Okamoto, Yasuhiro; Shirasaya, Kento; Kitada, Ryoji; Okada, Akira.

ICALEO 2013 - 32nd International Congress on Applications of Lasers and Electro-Optics. 2013. p. 829-835.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Okamoto, Y, Shirasaya, K, Kitada, R & Okada, A 2013, Singulation of semiconductor package by superposition of pulsed fiber laser and green yag laser. in ICALEO 2013 - 32nd International Congress on Applications of Lasers and Electro-Optics. pp. 829-835, 32nd International Congress on Applications of Lasers and Electro-Optics, ICALEO 2013, Miami, FL, United States, 10/6/13.
Okamoto Y, Shirasaya K, Kitada R, Okada A. Singulation of semiconductor package by superposition of pulsed fiber laser and green yag laser. In ICALEO 2013 - 32nd International Congress on Applications of Lasers and Electro-Optics. 2013. p. 829-835
Okamoto, Yasuhiro ; Shirasaya, Kento ; Kitada, Ryoji ; Okada, Akira. / Singulation of semiconductor package by superposition of pulsed fiber laser and green yag laser. ICALEO 2013 - 32nd International Congress on Applications of Lasers and Electro-Optics. 2013. pp. 829-835
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