Resist thinning effect on nanometer-scale line-edge roughness

Kenichi Kanzaki, Toru Yamaguchi, Masao Nagase, Kenji Yamazaki, Hideo Namatsu

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9 Citations (Scopus)

Abstract

The thickness dependence of the roughness of ultrathin (≤ 100 nm) electron-beam resist (ZEP520) was investigated using an atomic force microscope (AFM). The roughness (linewidth fluctuations of line patterns) increased with decreasing resist thickness, especially below 30 nm. On the other hand, polymer aggregates, which are well observed in conventional resists, existed in compressed form even in this ultrathin film. In addition, the dissolution rate of the resist tended to be faster with thickness reduction. Both the existence of polymer aggregates and the fast dissolution of the entire resist polymer possibly caused the larger roughness in the ultrathin resist films.

Original languageEnglish
JournalJapanese Journal of Applied Physics, Part 2: Letters
Volume41
Issue number11 B
Publication statusPublished - Nov 15 2002
Externally publishedYes

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Keywords

  • AFM
  • Dissolution rate
  • Electron beam
  • Line-edge roughness
  • Nanolithography
  • Polymer aggregate
  • Ultrathin resist film

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

Cite this

Kanzaki, K., Yamaguchi, T., Nagase, M., Yamazaki, K., & Namatsu, H. (2002). Resist thinning effect on nanometer-scale line-edge roughness. Japanese Journal of Applied Physics, Part 2: Letters, 41(11 B).