Resist coating on vertical side faces using conventional spin coating for creating three-dimensional nanostructures in semiconductors

Kenji Yamazaki, Hiroshi Yamaguchi

Research output: Contribution to journalArticle

9 Citations (Scopus)

Abstract

We have devised a new resist-coating method using spin coating for creating three-dimensional (3D) nanostructures in semiconductors. Using this method, we were able to successfully coat poly(methyl methacrylate) (PMMA) films on the vertical side faces of micrometer-order Si blocks. The use of a solvent with low viscosity was found to be effective for obtaining good uniformity in resist thickness. Moreover, Monte Carlo simulations of electron scattering revealed that fine patterning on both the opposite side faces of a Si block should be possible by simultaneous development followed by electron beam (EB) writing from opposite directions, despite electron scattering.

Original languageEnglish
Article number106501
JournalApplied Physics Express
Volume3
Issue number10
DOIs
Publication statusPublished - Oct 1 2010

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

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