Remotely-controlled tensile test of copper-cored lead-free solder joint in liquid using permanent magnet

Naoya Tada, Hiroyasu Masago

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Solder balls are used for electric connections in various electric devices. Since the electric devices have been widely used for automobiles, airplanes, electric home appliances, personal digital assistances besides conventional computers, their reliability under various conditions including humid and corrosive environments has to be evaluated. The authors proposed a non-contact tensile test method using permanent magnet and applied it to the solder joint testings. As the tensile force is remotely given to the solder joint, it becomes possible to isolate solder joint from gripping jig and set the joint in a liquid container. In this paper, tensile tests of copper-cored lead-free solder joint are carried out both in air and in water conditions, and the results on joint strength are discussed.

Original languageEnglish
Title of host publication2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Green and Cloud
Subtitle of host publicationCreating Value and Toward Eco-Life, IMPACT 2013 - Proceedings
Pages186-189
Number of pages4
DOIs
Publication statusPublished - Dec 1 2013
Event2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Green and Cloud: Creating Value and Toward Eco-Life, IMPACT 2013 - Taipei, Taiwan, Province of China
Duration: Oct 22 2013Oct 25 2013

Publication series

NameProceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
ISSN (Print)2150-5934
ISSN (Electronic)2150-5942

Other

Other2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Green and Cloud: Creating Value and Toward Eco-Life, IMPACT 2013
CountryTaiwan, Province of China
CityTaipei
Period10/22/1310/25/13

ASJC Scopus subject areas

  • Hardware and Architecture
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Tada, N., & Masago, H. (2013). Remotely-controlled tensile test of copper-cored lead-free solder joint in liquid using permanent magnet. In 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Green and Cloud: Creating Value and Toward Eco-Life, IMPACT 2013 - Proceedings (pp. 186-189). [6706624] (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT). https://doi.org/10.1109/IMPACT.2013.6706624