TY - GEN
T1 - Realization of Vibration Absorption at Multiple Frequencies on Vacuum Chamber with Cryopump
AU - Mizuno, Takeshi
AU - Iida, Takahito
AU - Ishino, Yuji
AU - Takasaki, Masaya
AU - Yamaguchi, Daisuke
AU - Hara, Masayuki
N1 - Funding Information:
*This work is supported by JSPS KAKENHI Grant Number 15K06185. 1Faculty of Science and Engineering, Department of Mechanical Engineering, Saga University, 1–Honjo Saga, Saga, JAPAN.
Funding Information:
ACKNOWLEDGMENT This work is supported by JSPS KAKENHI Grant Number 15K06185. The author would like to thank S. Fujiwara and K. Nakashima for technical assistance with the experiments.
Publisher Copyright:
© 2019 JSME.
PY - 2019/6
Y1 - 2019/6
N2 - A vibration isolation device with an active dynamic vibration absorber is developed to remove vibration induced by a cryopump. Cryopump is used to make high-vacuum and low-temperature environments for precise measurement. However, it induces vibrations with multiple frequencies, which may deteriorate measurement accuracy. This study focuses on removing low-frequency vibration because conventional vibration isolation devices for cryopump can hardly remove such vibration. In the developed vibration isolation device, an active vibration absorber is used to remove the vibration efficiently at low frequencies. In this report, the design concept and structure of the fabricated apparatus are described.
AB - A vibration isolation device with an active dynamic vibration absorber is developed to remove vibration induced by a cryopump. Cryopump is used to make high-vacuum and low-temperature environments for precise measurement. However, it induces vibrations with multiple frequencies, which may deteriorate measurement accuracy. This study focuses on removing low-frequency vibration because conventional vibration isolation devices for cryopump can hardly remove such vibration. In the developed vibration isolation device, an active vibration absorber is used to remove the vibration efficiently at low frequencies. In this report, the design concept and structure of the fabricated apparatus are described.
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M3 - Conference contribution
AN - SCOPUS:85069913777
T3 - 2019 12th Asian Control Conference, ASCC 2019
SP - 699
EP - 703
BT - 2019 12th Asian Control Conference, ASCC 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 12th Asian Control Conference, ASCC 2019
Y2 - 9 June 2019 through 12 June 2019
ER -