TY - GEN
T1 - Radiation-degradation Analysis and a Circuit Performance Improvement Method for Optoelectronic Field Programmable Gate Array
AU - Ito, Hirotoshi
AU - Watanabe, Minoru
N1 - Funding Information:
This research was partly supported by the Ministry of Internal Affairs and Communications of Japan under the Strategic Information and Communications R&D Promotion Programme (SCOPE). The VLSI chip in this study was fabricated in the chip fabrication program of VLSI Design and Education Center (VDEC), the University of Tokyo in collaboration with Rohm Co. Ltd. and Toppan Printing Co. Ltd.
Publisher Copyright:
© 2019 IEEE.
PY - 2019/9
Y1 - 2019/9
N2 - A radiation-hardened optoelectronic field programmable gate array (FPGA) consisting of a holographic memory, a laser array, and a standard CMOS process programmable gate array VLSI has already been developed. The optoelectronic FPGA provides soft-error tolerance and can withstand an over 1 Grad total-ionizing-dose. However, the degradation of the optoelectronic FPGA is not small and cannot be neglected. Propagation delay and power consumption increase along with increasing total-ionizing-dose. This paper presents the degradation measurement results of an optoelectronic radiation-hardened FPGA and a method to improve its performance.
AB - A radiation-hardened optoelectronic field programmable gate array (FPGA) consisting of a holographic memory, a laser array, and a standard CMOS process programmable gate array VLSI has already been developed. The optoelectronic FPGA provides soft-error tolerance and can withstand an over 1 Grad total-ionizing-dose. However, the degradation of the optoelectronic FPGA is not small and cannot be neglected. Propagation delay and power consumption increase along with increasing total-ionizing-dose. This paper presents the degradation measurement results of an optoelectronic radiation-hardened FPGA and a method to improve its performance.
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U2 - 10.1109/SOCC46988.2019.1570548505
DO - 10.1109/SOCC46988.2019.1570548505
M3 - Conference contribution
AN - SCOPUS:85085201365
T3 - International System on Chip Conference
SP - 306
EP - 311
BT - Proceedings - 32nd IEEE International System on Chip Conference, SOCC 2019
A2 - Zhao, Danella
A2 - Basu, Arindam
A2 - Bayoumi, Magdy
A2 - Hwee, Gwee Bah
A2 - Tong, Ge
A2 - Sridhar, Ramalingam
PB - IEEE Computer Society
T2 - 32nd IEEE International System on Chip Conference, SOCC 2019
Y2 - 3 September 2019 through 6 September 2019
ER -