Proximity Effects in Superconducting Wire Bonding

K. Tsukada; S. Yamasaki; N. Mizutani; G. Uehara; H. Kado; H. Akimoto; T. Ogashiwa

doi:10.1109/77.234024

Proximity Effects in Superconducting Wire Bonding

K. Tsukada, S. Yamasaki, N. Mizutani, G. Uehara, H. Kado, H. Akimoto, T. Ogashiwa

Research output: Contribution to journal › Comment/debate › peer-review

3 Citations (Scopus)

Abstract

To investigate the superconducting characteristics of a superconducting wire bonding connection, a series of Nb electrodes consisting of an Au pad formed on a Si chip are made, and the pads are connected in series with a superconducting wire (Pb76in2oAu4). The I-V characteristics of the superconducting connection reflect the typical characteristics of an S-N-S sandwich structure, with normal resistance on the order of μω when a critical current(Ic) level is exceeded. The dependence of Ic on the thickness of Au is an exponential decrement, and Ic is over a hundred mA when Au thickness is between 20 nm and 230 nm. Auger analysis is applied to obtain the depth profile of the bonded part, revealing mutual Au and In atomic diffusion at the interface between the Au intermediate layer and the PblnAu wire.

Original language	English
Pages (from-to)	2965-2967
Number of pages	3
Journal	IEEE Transactions on Applied Superconductivity
Volume	3
Issue number	1
DOIs	https://doi.org/10.1109/77.234024
Publication status	Published - Mar 1993
Externally published	Yes

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering

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abstract = "To investigate the superconducting characteristics of a superconducting wire bonding connection, a series of Nb electrodes consisting of an Au pad formed on a Si chip are made, and the pads are connected in series with a superconducting wire (Pb76in2oAu4). The I-V characteristics of the superconducting connection reflect the typical characteristics of an S-N-S sandwich structure, with normal resistance on the order of μω when a critical current(Ic) level is exceeded. The dependence of Ic on the thickness of Au is an exponential decrement, and Ic is over a hundred mA when Au thickness is between 20 nm and 230 nm. Auger analysis is applied to obtain the depth profile of the bonded part, revealing mutual Au and In atomic diffusion at the interface between the Au intermediate layer and the PblnAu wire.",

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T1 - Proximity Effects in Superconducting Wire Bonding

AU - Tsukada, K.

AU - Yamasaki, S.

AU - Mizutani, N.

AU - Uehara, G.

AU - Kado, H.

AU - Akimoto, H.

AU - Ogashiwa, T.

PY - 1993/3

Y1 - 1993/3

N2 - To investigate the superconducting characteristics of a superconducting wire bonding connection, a series of Nb electrodes consisting of an Au pad formed on a Si chip are made, and the pads are connected in series with a superconducting wire (Pb76in2oAu4). The I-V characteristics of the superconducting connection reflect the typical characteristics of an S-N-S sandwich structure, with normal resistance on the order of μω when a critical current(Ic) level is exceeded. The dependence of Ic on the thickness of Au is an exponential decrement, and Ic is over a hundred mA when Au thickness is between 20 nm and 230 nm. Auger analysis is applied to obtain the depth profile of the bonded part, revealing mutual Au and In atomic diffusion at the interface between the Au intermediate layer and the PblnAu wire.

AB - To investigate the superconducting characteristics of a superconducting wire bonding connection, a series of Nb electrodes consisting of an Au pad formed on a Si chip are made, and the pads are connected in series with a superconducting wire (Pb76in2oAu4). The I-V characteristics of the superconducting connection reflect the typical characteristics of an S-N-S sandwich structure, with normal resistance on the order of μω when a critical current(Ic) level is exceeded. The dependence of Ic on the thickness of Au is an exponential decrement, and Ic is over a hundred mA when Au thickness is between 20 nm and 230 nm. Auger analysis is applied to obtain the depth profile of the bonded part, revealing mutual Au and In atomic diffusion at the interface between the Au intermediate layer and the PblnAu wire.

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Proximity Effects in Superconducting Wire Bonding

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