Power/ground layers with EBG structure and ferrite film for noise suppression and power integrity improvement

Farhan Zaheed Mahmood; Yoshitaka Toyota; Kengo Iokibe; Koichi Kondo; Shigeyoshi Yoshida

doi:10.1109/EDAPS.2011.6213804

Power/ground layers with EBG structure and ferrite film for noise suppression and power integrity improvement

Farhan Zaheed Mahmood, Yoshitaka Toyota, Kengo Iokibe, Koichi Kondo, Shigeyoshi Yoshida

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

5 Citations (Scopus)

Abstract

Noise suppression and power integrity (PI) are two requirements for power/ground layers of printed circuit boards (PCBs). We have proposed the application of electromagnetic bandgap (EBG) structure and ferrite film to power/ground layers. In this paper, not only a test board with the proposed structure but three other test boards to be compared were fabricated to measure with a vector network analyzer. The measured data was evaluated for noise-suppression and PI characteristics. Additional evaluation using a commercial circuit simulator was carried out to evaluate noise-suppression and PI characteristics, assuming a real power-supply circuit. Through the evaluation, the test boards with ferrite film including the proposed structure provided sufficient results.

Original language	English
Title of host publication	2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011
DOIs	https://doi.org/10.1109/EDAPS.2011.6213804
Publication status	Published - Dec 1 2011
Event	2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011 - Hanzhou, China Duration: Dec 12 2011 → Dec 14 2011

Publication series

Name	2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011

Other

Other	2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011
Country/Territory	China
City	Hanzhou
Period	12/12/11 → 12/14/11

ASJC Scopus subject areas

Electrical and Electronic Engineering

Access to Document

10.1109/EDAPS.2011.6213804

Cite this

Mahmood, F. Z., Toyota, Y., Iokibe, K., Kondo, K., & Yoshida, S. (2011). Power/ground layers with EBG structure and ferrite film for noise suppression and power integrity improvement. In 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011 [6213804] (2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011). https://doi.org/10.1109/EDAPS.2011.6213804

Power/ground layers with EBG structure and ferrite film for noise suppression and power integrity improvement. / Mahmood, Farhan Zaheed; Toyota, Yoshitaka ; Iokibe, Kengo et al.

2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011. 2011. 6213804 (2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Mahmood, FZ, Toyota, Y , Iokibe, K, Kondo, K & Yoshida, S 2011, Power/ground layers with EBG structure and ferrite film for noise suppression and power integrity improvement. in 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011., 6213804, 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011, 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011, Hanzhou, China, 12/12/11. https://doi.org/10.1109/EDAPS.2011.6213804

Mahmood FZ, Toyota Y , Iokibe K, Kondo K, Yoshida S. Power/ground layers with EBG structure and ferrite film for noise suppression and power integrity improvement. In 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011. 2011. 6213804. (2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011). doi: 10.1109/EDAPS.2011.6213804

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Power/ground layers with EBG structure and ferrite film for noise suppression and power integrity improvement

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