Power/ground layers with EBG structure and ferrite film for noise suppression and power integrity improvement

Farhan Zaheed Mahmood, Yoshitaka Toyota, Kengo Iokibe, Koichi Kondo, Shigeyoshi Yoshida

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Noise suppression and power integrity (PI) are two requirements for power/ground layers of printed circuit boards (PCBs). We have proposed the application of electromagnetic bandgap (EBG) structure and ferrite film to power/ground layers. In this paper, not only a test board with the proposed structure but three other test boards to be compared were fabricated to measure with a vector network analyzer. The measured data was evaluated for noise-suppression and PI characteristics. Additional evaluation using a commercial circuit simulator was carried out to evaluate noise-suppression and PI characteristics, assuming a real power-supply circuit. Through the evaluation, the test boards with ferrite film including the proposed structure provided sufficient results.

Original languageEnglish
Title of host publication2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011
DOIs
Publication statusPublished - 2011
Event2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011 - Hanzhou, China
Duration: Dec 12 2011Dec 14 2011

Other

Other2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011
CountryChina
CityHanzhou
Period12/12/1112/14/11

Fingerprint

Ferrite
Energy gap
Power supply circuits
Electric network analyzers
Printed circuit boards
Simulators
Networks (circuits)

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Mahmood, F. Z., Toyota, Y., Iokibe, K., Kondo, K., & Yoshida, S. (2011). Power/ground layers with EBG structure and ferrite film for noise suppression and power integrity improvement. In 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011 [6213804] https://doi.org/10.1109/EDAPS.2011.6213804

Power/ground layers with EBG structure and ferrite film for noise suppression and power integrity improvement. / Mahmood, Farhan Zaheed; Toyota, Yoshitaka; Iokibe, Kengo; Kondo, Koichi; Yoshida, Shigeyoshi.

2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011. 2011. 6213804.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Mahmood, FZ, Toyota, Y, Iokibe, K, Kondo, K & Yoshida, S 2011, Power/ground layers with EBG structure and ferrite film for noise suppression and power integrity improvement. in 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011., 6213804, 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011, Hanzhou, China, 12/12/11. https://doi.org/10.1109/EDAPS.2011.6213804
Mahmood FZ, Toyota Y, Iokibe K, Kondo K, Yoshida S. Power/ground layers with EBG structure and ferrite film for noise suppression and power integrity improvement. In 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011. 2011. 6213804 https://doi.org/10.1109/EDAPS.2011.6213804
Mahmood, Farhan Zaheed ; Toyota, Yoshitaka ; Iokibe, Kengo ; Kondo, Koichi ; Yoshida, Shigeyoshi. / Power/ground layers with EBG structure and ferrite film for noise suppression and power integrity improvement. 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011. 2011.
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