Power-bus noise reduction using ferrite-covered open stub in printed circuit board

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

For suppressing the power-bus resonance at higher frequencies, which causes propagation of electromagnetic noise and detraction of power integrity, we proposed a lossy resonator filter with frequency selectivity and low loss. To suppress noise propagation in the power-ground plane pair of a printed circuit board (PCB) at high frequencies (over 1 GHz), a ferrite-covered open stub was formed on a PCB as a lossy resonator filter. Its characteristics were verified by not only full-wave simulation but also measurement using a vector network analyzer. The simulation and measurement results show that the noise in the power bus of the PCB at frequencies over 1 GHz is suppressed. Through a series of investigations focusing on the input impedance characteristics, this paper clarified that low impedance of the open stub around resonant frequency helps prevent the impedance of the power-ground plane pair from increasing due to parallel plate resonances to achieve power-bus noise reduction.

Original languageEnglish
Title of host publicationIEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages79-82
Number of pages4
ISBN (Print)9781479961955
DOIs
Publication statusPublished - Jan 13 2015
Event2014 4th IEEE CPMT Symposium Japan, ICSJ 2014 - Kyoto, Japan
Duration: Nov 4 2014Nov 6 2014

Other

Other2014 4th IEEE CPMT Symposium Japan, ICSJ 2014
CountryJapan
CityKyoto
Period11/4/1411/6/14

Fingerprint

Noise abatement
Printed circuit boards
Ferrite
Acoustic impedance
Resonators
Electric network analyzers
Natural frequencies

Keywords

  • ferrite thin film
  • lossy resonator filter
  • noise reduction
  • open stub
  • printed circuit board

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Toyota, Y. (2015). Power-bus noise reduction using ferrite-covered open stub in printed circuit board. In IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014 (pp. 79-82). [7009614] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICSJ.2014.7009614

Power-bus noise reduction using ferrite-covered open stub in printed circuit board. / Toyota, Yoshitaka.

IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014. Institute of Electrical and Electronics Engineers Inc., 2015. p. 79-82 7009614.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Toyota, Y 2015, Power-bus noise reduction using ferrite-covered open stub in printed circuit board. in IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014., 7009614, Institute of Electrical and Electronics Engineers Inc., pp. 79-82, 2014 4th IEEE CPMT Symposium Japan, ICSJ 2014, Kyoto, Japan, 11/4/14. https://doi.org/10.1109/ICSJ.2014.7009614
Toyota Y. Power-bus noise reduction using ferrite-covered open stub in printed circuit board. In IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014. Institute of Electrical and Electronics Engineers Inc. 2015. p. 79-82. 7009614 https://doi.org/10.1109/ICSJ.2014.7009614
Toyota, Yoshitaka. / Power-bus noise reduction using ferrite-covered open stub in printed circuit board. IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014. Institute of Electrical and Electronics Engineers Inc., 2015. pp. 79-82
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