Possible involvement of the ugpA gene product in the stable maintenance of mini-F plasmid in Escherichia coli

Bunichi Ezaki, Hirotada Mori, Teru Ogura, Sota Hiraga

Research output: Contribution to journalArticle

Abstract

The seg-3 mutant Escherichia coli does not support the maintenance of mini-F plasmid at 42° C. We cloned the chromosomal DNA segment of the wild-type strain W3110 that complements the Seg- phenotype of this mutant. Cleavage mapping of this segment showed that it was derived from the 76-min region of the E. coli chromosome map. Complementation tests using plasmids carrying subcloned DNA segments suggested that the seg-3 mutant carried two mutations that additively affected the maintenance of mini-F plasmid; one was in the ugpA gene and the other was presumably in the rpoH gene. We generated a disrupted ugpA null mutant and found that the mini-F plasmid was unstable in this ugpA null mutant even at 30° C. This suggests that the ugpA gene product is required for the stable maintenance of mini-F plasmid.

Original languageEnglish
Pages (from-to)361-368
Number of pages8
JournalMGG Molecular & General Genetics
Volume223
Issue number3
DOIs
Publication statusPublished - Sep 1990
Externally publishedYes

Fingerprint

F Factor
Maintenance
Escherichia coli
Genes
Genetic Complementation Test
DNA
Plasmids
Chromosomes
Phenotype
Mutation

Keywords

  • F plasmid
  • Heat shock response
  • Phosphate transport system
  • Plasmid maintenance
  • seg-3 mutant

ASJC Scopus subject areas

  • Genetics

Cite this

Possible involvement of the ugpA gene product in the stable maintenance of mini-F plasmid in Escherichia coli. / Ezaki, Bunichi; Mori, Hirotada; Ogura, Teru; Hiraga, Sota.

In: MGG Molecular & General Genetics, Vol. 223, No. 3, 09.1990, p. 361-368.

Research output: Contribution to journalArticle

Ezaki, Bunichi ; Mori, Hirotada ; Ogura, Teru ; Hiraga, Sota. / Possible involvement of the ugpA gene product in the stable maintenance of mini-F plasmid in Escherichia coli. In: MGG Molecular & General Genetics. 1990 ; Vol. 223, No. 3. pp. 361-368.
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