Abstract
Change in crystal orientation and strain of individual grains during tensile plastic deformation are studied to clarify on the microscopic deformation behavior of polycrystalline copper. The orientation of grain is measured by electron backscatter diffraction technique in the scanning electron microscope. The principal strain of grain is also measured by obtaining the approximated ellipse of strain distribution. The deformation of grains dependent on their initial orientation and the rotation of the principal strain during uniaxial tension are clarified.
| Original language | English |
|---|---|
| Pages (from-to) | 535-540 |
| Number of pages | 6 |
| Journal | Key Engineering Materials |
| Volume | 233-236 |
| Issue number | II |
| Publication status | Published - Dec 1 2002 |
| Event | Proceedings of the 6th Asia-Pacific Symposium on Engineering Plasticity and Its Applications (AEPA2002) - Sydney, NSW, Australia Duration: Dec 2 2002 → Dec 6 2002 |
Fingerprint
Keywords
- Crystal orientation
- EBSD method
- Plastic deformation
- Polycrystalline copper
- SEM
ASJC Scopus subject areas
- Materials Science(all)
- Mechanics of Materials
- Mechanical Engineering
Cite this
Abe, T., Kondou, R., Tada, N., & Shimizu, I. (2002). Orientation change measured by the EBSD method and the plastic deformation of grains in polycrystalline copper. Key Engineering Materials, 233-236(II), 535-540.