Orientation change measured by the EBSD method and the plastic deformation of grains in polycrystalline copper

Takeji Abe, Ryouji Kondou, Naoya Tada, Ichiro Shimizu

Research output: Contribution to journalArticle

Abstract

Change in crystal orientation and strain of individual grains during tensile plastic deformation are studied to clarify on the microscopic deformation behavior of polycrystalline copper. The orientation of grain is measured by electron backscatter diffraction technique in the scanning electron microscope. The principal strain of grain is also measured by obtaining the approximated ellipse of strain distribution. The deformation of grains dependent on their initial orientation and the rotation of the principal strain during uniaxial tension are clarified.

Original languageEnglish
Pages (from-to)535-540
Number of pages6
JournalKey Engineering Materials
Volume233-236
Issue numberII
Publication statusPublished - 2002

Fingerprint

Copper
Plastic deformation
Electron diffraction
Crystal orientation
Electron microscopes
Scanning

Keywords

  • Crystal orientation
  • EBSD method
  • Plastic deformation
  • Polycrystalline copper
  • SEM

ASJC Scopus subject areas

  • Ceramics and Composites
  • Chemical Engineering (miscellaneous)

Cite this

Orientation change measured by the EBSD method and the plastic deformation of grains in polycrystalline copper. / Abe, Takeji; Kondou, Ryouji; Tada, Naoya; Shimizu, Ichiro.

In: Key Engineering Materials, Vol. 233-236, No. II, 2002, p. 535-540.

Research output: Contribution to journalArticle

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