TY - GEN
T1 - Optimal resistance determination method for RL damper circuits in power distribution network of ICs
AU - Yamagata, Ryosuke
AU - Iokibe, Kengo
AU - Toyota, Yoshitaka
PY - 2012/12/1
Y1 - 2012/12/1
N2 - We investigated a method using parallel RL circuits inserted into power distribution network (PDN) of integrated circuits (ICs) to enhance the IC in EMI and PI performance. Optimal damping resistances of the parallel RL circuit were derived from a characteristic equation of an equivalent circuit of a partial PDN that contributed to PDN resonances dominantly. The parallel RL circuit with the optimal resistances damps the PDN resonances as quickly as possible and reduces peaks in simultaneous switching current that will cause EMI and in input impedance of PDN related to PI. We validated the parallel RL circuit with respect to EMI and PI performance of ICs numerically and experimentally. Results of these validation showed that the proposed method descend the simultaneous switching current at both chip-package-board and on-board resonant frequency. It is also confirmed that insertion of the parallel RL circuits into the power trace reduced the impedance peak due to the chip-package-board resonance.
AB - We investigated a method using parallel RL circuits inserted into power distribution network (PDN) of integrated circuits (ICs) to enhance the IC in EMI and PI performance. Optimal damping resistances of the parallel RL circuit were derived from a characteristic equation of an equivalent circuit of a partial PDN that contributed to PDN resonances dominantly. The parallel RL circuit with the optimal resistances damps the PDN resonances as quickly as possible and reduces peaks in simultaneous switching current that will cause EMI and in input impedance of PDN related to PI. We validated the parallel RL circuit with respect to EMI and PI performance of ICs numerically and experimentally. Results of these validation showed that the proposed method descend the simultaneous switching current at both chip-package-board and on-board resonant frequency. It is also confirmed that insertion of the parallel RL circuits into the power trace reduced the impedance peak due to the chip-package-board resonance.
UR - http://www.scopus.com/inward/record.url?scp=84874342732&partnerID=8YFLogxK
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U2 - 10.1109/CEEM.2012.6410607
DO - 10.1109/CEEM.2012.6410607
M3 - Conference contribution
AN - SCOPUS:84874342732
SN - 9781467300308
T3 - Proceedings - 2012 6th Asia-Pacific Conference on Environmental Electromagnetics, CEEM 2012
SP - 222
EP - 225
BT - Proceedings - 2012 6th Asia-Pacific Conference on Environmental Electromagnetics, CEEM 2012
T2 - 2012 6th Asia-Pacific Conference on Environmental Electromagnetics, CEEM 2012
Y2 - 6 November 2012 through 9 November 2012
ER -