Optical interconnection between III-V chips on Si by using photonic wire bonding

Zhichen Gu, Tomohiro Amemiya, Atsushi Ishikawa, Takuo Hiratani, Junichi Suzuki, Nobuhiko Nishiyama, Takuo Tanaka, Shigehisa Arai

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We connected two III-V laser and photodiode chips on Si substrate by using three-dimensional polymeric wires based on two-photon polymerization. We achieved an enhancement of the transmitting efficiency through PWB compare to the free-space transmission.

Original languageEnglish
Title of host publication2015 IEEE Optical Interconnects Conference, OI 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages120-121
Number of pages2
ISBN (Print)9781479981793
DOIs
Publication statusPublished - May 29 2015
Event2015 IEEE Optical Interconnects Conference, OI 2015 - San Diego, United States
Duration: Apr 20 2015Apr 22 2015

Other

Other2015 IEEE Optical Interconnects Conference, OI 2015
CountryUnited States
CitySan Diego
Period4/20/154/22/15

Fingerprint

Optical interconnects
Photodiodes
Photonics
photodiodes
Photons
polymerization
chips
Polymerization
wire
Wire
photonics
Lasers
augmentation
photons
Substrates
lasers

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Computer Networks and Communications
  • Hardware and Architecture
  • Atomic and Molecular Physics, and Optics
  • Electrical and Electronic Engineering

Cite this

Gu, Z., Amemiya, T., Ishikawa, A., Hiratani, T., Suzuki, J., Nishiyama, N., ... Arai, S. (2015). Optical interconnection between III-V chips on Si by using photonic wire bonding. In 2015 IEEE Optical Interconnects Conference, OI 2015 (pp. 120-121). [7115715] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/OIC.2015.7115715

Optical interconnection between III-V chips on Si by using photonic wire bonding. / Gu, Zhichen; Amemiya, Tomohiro; Ishikawa, Atsushi; Hiratani, Takuo; Suzuki, Junichi; Nishiyama, Nobuhiko; Tanaka, Takuo; Arai, Shigehisa.

2015 IEEE Optical Interconnects Conference, OI 2015. Institute of Electrical and Electronics Engineers Inc., 2015. p. 120-121 7115715.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Gu, Z, Amemiya, T, Ishikawa, A, Hiratani, T, Suzuki, J, Nishiyama, N, Tanaka, T & Arai, S 2015, Optical interconnection between III-V chips on Si by using photonic wire bonding. in 2015 IEEE Optical Interconnects Conference, OI 2015., 7115715, Institute of Electrical and Electronics Engineers Inc., pp. 120-121, 2015 IEEE Optical Interconnects Conference, OI 2015, San Diego, United States, 4/20/15. https://doi.org/10.1109/OIC.2015.7115715
Gu Z, Amemiya T, Ishikawa A, Hiratani T, Suzuki J, Nishiyama N et al. Optical interconnection between III-V chips on Si by using photonic wire bonding. In 2015 IEEE Optical Interconnects Conference, OI 2015. Institute of Electrical and Electronics Engineers Inc. 2015. p. 120-121. 7115715 https://doi.org/10.1109/OIC.2015.7115715
Gu, Zhichen ; Amemiya, Tomohiro ; Ishikawa, Atsushi ; Hiratani, Takuo ; Suzuki, Junichi ; Nishiyama, Nobuhiko ; Tanaka, Takuo ; Arai, Shigehisa. / Optical interconnection between III-V chips on Si by using photonic wire bonding. 2015 IEEE Optical Interconnects Conference, OI 2015. Institute of Electrical and Electronics Engineers Inc., 2015. pp. 120-121
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