Optical interconnection between III-V chips on Si by using photonic wire bonding

Zhichen Gu, Tomohiro Amemiya, Atsushi Ishikawa, Takuo Hiratani, Junichi Suzuki, Nobuhiko Nishiyama, Takuo Tanaka, Shigehisa Arai

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We connected two III-V laser and photodiode chips on Si substrate by using three-dimensional polymeric wires based on two-photon polymerization. We achieved an enhancement of the transmitting efficiency through PWB compare to the free-space transmission.

Original languageEnglish
Title of host publication2015 IEEE Optical Interconnects Conference, OI 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages120-121
Number of pages2
ISBN (Electronic)9781479981793
DOIs
Publication statusPublished - May 29 2015
Event2015 IEEE Optical Interconnects Conference, OI 2015 - San Diego, United States
Duration: Apr 20 2015Apr 22 2015

Publication series

Name2015 IEEE Optical Interconnects Conference, OI 2015

Other

Other2015 IEEE Optical Interconnects Conference, OI 2015
CountryUnited States
CitySan Diego
Period4/20/154/22/15

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Computer Networks and Communications
  • Hardware and Architecture
  • Atomic and Molecular Physics, and Optics
  • Electrical and Electronic Engineering

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  • Cite this

    Gu, Z., Amemiya, T., Ishikawa, A., Hiratani, T., Suzuki, J., Nishiyama, N., Tanaka, T., & Arai, S. (2015). Optical interconnection between III-V chips on Si by using photonic wire bonding. In 2015 IEEE Optical Interconnects Conference, OI 2015 (pp. 120-121). [7115715] (2015 IEEE Optical Interconnects Conference, OI 2015). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/OIC.2015.7115715