Novel micro-welding of silicon and glass by ultrashort pulsed laser

Yasuhiro Okamoto, Isamu Miyamoto, Jorma Vihinen, Akira Okada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

The laser welding can provide flexible processing, and ultrashort pulsed laser with high pulse repetition rates enabled locally selective welding of monocrystalline silicon and glass with comparable processing performance to anodic bonding method. The 20ps laser pulse of 1060nm was absorbed at monocrystalline silicon through glass plate, and its surface temperature reached its boiling temperature. In addition, it was considered that the absorption of laser energy to glass was occurred, and the temperature of glass increased more than the forming temperature. Thus the convection of silicon and glass was caused by the recoil pressure of evaporation, which led to mild mixture of silicon and glass. This phenomenon produced anchor geometry at the interface between silicon and glass without gap generation. The number of laser shot in the laser spot had an influence on shearing strength of weld joint, and higher shearing strength of weld joint could be performed at proper number of laser shot in the laser spot.

Original languageEnglish
Title of host publicationAdvanced Materials Research
PublisherTrans Tech Publications
Pages2792-2797
Number of pages6
Volume783-786
ISBN (Print)9783038350736
DOIs
Publication statusPublished - 2014
Event8th International Conference on Processing and Manufacturing of Advanced Materials, THERMEC 2013 - Las Vegas, NV, United States
Duration: Dec 2 2013Dec 6 2013

Publication series

NameAdvanced Materials Research
Volume783-786
ISSN (Print)10226680

Other

Other8th International Conference on Processing and Manufacturing of Advanced Materials, THERMEC 2013
CountryUnited States
CityLas Vegas, NV
Period12/2/1312/6/13

Fingerprint

Pulsed lasers
Welding
Glass
Silicon
Lasers
Monocrystalline silicon
Shearing
Welds
Pulse repetition rate
Temperature
Laser beam welding
Processing
Anchors
Boiling liquids
Laser pulses
Evaporation
Geometry

Keywords

  • Glass
  • Joining
  • Micro-welding
  • Picosecond laser
  • Silicon
  • Ultrashort pulsed laser

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Okamoto, Y., Miyamoto, I., Vihinen, J., & Okada, A. (2014). Novel micro-welding of silicon and glass by ultrashort pulsed laser. In Advanced Materials Research (Vol. 783-786, pp. 2792-2797). (Advanced Materials Research; Vol. 783-786). Trans Tech Publications. https://doi.org/10.4028/www.scientific.net/MSF.783-786.2792

Novel micro-welding of silicon and glass by ultrashort pulsed laser. / Okamoto, Yasuhiro; Miyamoto, Isamu; Vihinen, Jorma; Okada, Akira.

Advanced Materials Research. Vol. 783-786 Trans Tech Publications, 2014. p. 2792-2797 (Advanced Materials Research; Vol. 783-786).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Okamoto, Y, Miyamoto, I, Vihinen, J & Okada, A 2014, Novel micro-welding of silicon and glass by ultrashort pulsed laser. in Advanced Materials Research. vol. 783-786, Advanced Materials Research, vol. 783-786, Trans Tech Publications, pp. 2792-2797, 8th International Conference on Processing and Manufacturing of Advanced Materials, THERMEC 2013, Las Vegas, NV, United States, 12/2/13. https://doi.org/10.4028/www.scientific.net/MSF.783-786.2792
Okamoto Y, Miyamoto I, Vihinen J, Okada A. Novel micro-welding of silicon and glass by ultrashort pulsed laser. In Advanced Materials Research. Vol. 783-786. Trans Tech Publications. 2014. p. 2792-2797. (Advanced Materials Research). https://doi.org/10.4028/www.scientific.net/MSF.783-786.2792
Okamoto, Yasuhiro ; Miyamoto, Isamu ; Vihinen, Jorma ; Okada, Akira. / Novel micro-welding of silicon and glass by ultrashort pulsed laser. Advanced Materials Research. Vol. 783-786 Trans Tech Publications, 2014. pp. 2792-2797 (Advanced Materials Research).
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