Novel hydrophobic/hydrophilic patterning process by photocatalytic Ag nucleation on TiO                         2                          thin film and electroless Cu deposition

Shunsuke Nishimoto; Atsushi Kubo; Xintong Zhang; Zhaoyue Liu; Noriaki Taneichi; Toshiki Okui; Taketoshi Murakami; Takashi Komine; Akira Fujishima

doi:10.1016/j.apsusc.2008.03.153

Novel hydrophobic/hydrophilic patterning process by photocatalytic Ag nucleation on TiO ₂ thin film and electroless Cu deposition

Shunsuke Nishimoto, Atsushi Kubo, Xintong Zhang, Zhaoyue Liu, Noriaki Taneichi, Toshiki Okui, Taketoshi Murakami, Takashi Komine, Akira Fujishima

Research output: Contribution to journal › Article › peer-review

30 Citations (Scopus)

Abstract

A hydrophobic/super-hydrophilic pattern was prepared on a TiO ₂ thin film by a new fabrication process. The process consists of five key steps: (1) photocatalytic reduction of Ag ⁺ to Ag (nucleation), (2) electroless Cu deposition, (3) oxidation of Cu to CuO, (4) deposition of a self-assembled monolayer (SAM), and (5) photocatalytic decomposition of selected areas of the SAM. A hydrophobic/super-hydrophilic pattern with 500-μm ² hydrophilic areas was obtained in this process. It is particularly noteworthy that a UV irradiation time of only 1 s was sufficient for the nucleation step in the patterning process.

Original language	English
Pages (from-to)	5891-5894
Number of pages	4
Journal	Applied Surface Science
Volume	254
Issue number	18
DOIs	https://doi.org/10.1016/j.apsusc.2008.03.153
Publication status	Published - Jul 15 2008
Externally published	Yes

Keywords

Hydrophobic
Super-hydrophilic
Surface patterning
TiO photocatalyst

ASJC Scopus subject areas

Chemistry(all)
Condensed Matter Physics
Physics and Astronomy(all)
Surfaces and Interfaces
Surfaces, Coatings and Films

Access to Document

10.1016/j.apsusc.2008.03.153

Cite this

Nishimoto, S., Kubo, A., Zhang, X., Liu, Z., Taneichi, N., Okui, T., Murakami, T., Komine, T., & Fujishima, A. (2008). Novel hydrophobic/hydrophilic patterning process by photocatalytic Ag nucleation on TiO ₂ thin film and electroless Cu deposition Applied Surface Science, 254(18), 5891-5894. https://doi.org/10.1016/j.apsusc.2008.03.153

Novel hydrophobic/hydrophilic patterning process by photocatalytic Ag nucleation on TiO ₂ thin film and electroless Cu deposition . / Nishimoto, Shunsuke; Kubo, Atsushi; Zhang, Xintong; Liu, Zhaoyue; Taneichi, Noriaki; Okui, Toshiki; Murakami, Taketoshi; Komine, Takashi; Fujishima, Akira.

In: Applied Surface Science, Vol. 254, No. 18, 15.07.2008, p. 5891-5894.

Research output: Contribution to journal › Article › peer-review

Nishimoto, S, Kubo, A, Zhang, X, Liu, Z, Taneichi, N, Okui, T, Murakami, T, Komine, T & Fujishima, A 2008, ' Novel hydrophobic/hydrophilic patterning process by photocatalytic Ag nucleation on TiO ₂ thin film and electroless Cu deposition ', Applied Surface Science, vol. 254, no. 18, pp. 5891-5894. https://doi.org/10.1016/j.apsusc.2008.03.153

Nishimoto S, Kubo A, Zhang X, Liu Z, Taneichi N, Okui T et al. Novel hydrophobic/hydrophilic patterning process by photocatalytic Ag nucleation on TiO ₂ thin film and electroless Cu deposition Applied Surface Science. 2008 Jul 15;254(18):5891-5894. https://doi.org/10.1016/j.apsusc.2008.03.153

Nishimoto, Shunsuke ; Kubo, Atsushi ; Zhang, Xintong ; Liu, Zhaoyue ; Taneichi, Noriaki ; Okui, Toshiki ; Murakami, Taketoshi ; Komine, Takashi ; Fujishima, Akira. / Novel hydrophobic/hydrophilic patterning process by photocatalytic Ag nucleation on TiO ₂ thin film and electroless Cu deposition In: Applied Surface Science. 2008 ; Vol. 254, No. 18. pp. 5891-5894.

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AU - Taneichi, Noriaki

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