Non-cyclic scheduling of dual-armed cluster tools for bi-objective minimization of wafer residence time and makespan

Masaru Sakai, Tatsushi Nishi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Dual-armed cluster tools are widely used for semiconductor manufacturing. The system consists of several loadlock modules, processing modules, and material handling robots for transferring wafers between them. Most of the conventional works focused on the scheduling cluster tools for the minimization of makespan. It is also important to minimize the residence time in the process module in order to prevent the deterioration of the quality of the wafer surface. Also, cluster tools have to avoid deadlock situations which may lead to excessive loss for wafer fabrication system. In this paper, we propose an efficient scheduling method for deadlock avoidance strategy and the bi-objective of the minimization of makespan and wafer residence time.

Original languageEnglish
Title of host publication2016 International Conference on Industrial Engineering and Engineering Management, IEEM 2016
PublisherIEEE Computer Society
Pages1016-1020
Number of pages5
ISBN (Electronic)9781509036653
DOIs
Publication statusPublished - Dec 27 2016
Externally publishedYes
Event2016 International Conference on Industrial Engineering and Engineering Management, IEEM 2016 - Bali, Indonesia
Duration: Dec 4 2016Dec 7 2016

Publication series

NameIEEE International Conference on Industrial Engineering and Engineering Management
Volume2016-December
ISSN (Print)2157-3611
ISSN (Electronic)2157-362X

Conference

Conference2016 International Conference on Industrial Engineering and Engineering Management, IEEM 2016
CountryIndonesia
CityBali
Period12/4/1612/7/16

Keywords

  • Cluster tool scheduling
  • Deadlock avoidance policy
  • Petri net
  • Residence time

ASJC Scopus subject areas

  • Business, Management and Accounting (miscellaneous)
  • Industrial and Manufacturing Engineering
  • Safety, Risk, Reliability and Quality

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