Abstract
Multi-wire EDM slicing method have been developed to overcome problems of multi-wire saw method, and high-efficient and high-accurate slicing could be expected compared with a single-wire EDM technologies. However, a multi-wire EDM slicing equipment becomes very complex in the case of an individual power supplying method with multiple power units and conductivity piece sets. This traditional method leads to difficulties in the preparation and a heavy load on the maintenance for a multi-wire EDM slicing equipment. Therefore, a group power supplying method was newly proposed to satisfy both processing efficiency and simplification of slicing equipment, since it can supply sufficient energy to multiple processing wire electrodes only using one conductivity piece set with one EDM power unit. When monocrystalline silicon ingot was sliced by using steel wire electrode of 120 μm with the group power supplying method, discharge current per wire ideally changed with number of processing wire electrodes. However, kerf width was approximately constant at almost constant cutting speed regardless of number of processing wire electrodes. In addition, diameter of crater caused by electrical discharge pulse was dependent on the peak discharge current per wire rather than the total peak discharge current. These results indicate that input energies were almost constant at each processing wire electrode, and electrical discharge pulses could be homogeneously distributed to each processing wire electrode without the breakage even by using only one conductivity piece set in the group power supplying method.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the 17th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2017 |
| Publisher | euspen |
| Pages | 183-184 |
| Number of pages | 2 |
| ISBN (Electronic) | 9780995775107 |
| Publication status | Published - Jan 1 2017 |
| Event | 17th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2017 - Hannover, Germany Duration: May 29 2017 → Jun 2 2017 |
Other
| Other | 17th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2017 |
|---|---|
| Country | Germany |
| City | Hannover |
| Period | 5/29/17 → 6/2/17 |
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Keywords
- Group power supplying method
- Multi-wire
- Semiconductor
- Silicon
- Slicing
- Wire EDM
ASJC Scopus subject areas
- Materials Science(all)
- Mechanical Engineering
- Instrumentation
- Industrial and Manufacturing Engineering
- Environmental Engineering
Cite this
Multi-wire EDM slicing of semiconductors with group power supplying method. / Okamoto, Yasuhiro; Ikeda, Takayuki; Kurihara, Haruya; Okada, Akira; Kido, Masataka.
Proceedings of the 17th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2017. euspen, 2017. p. 183-184.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Multi-wire EDM slicing of semiconductors with group power supplying method
AU - Okamoto, Yasuhiro
AU - Ikeda, Takayuki
AU - Kurihara, Haruya
AU - Okada, Akira
AU - Kido, Masataka
PY - 2017/1/1
Y1 - 2017/1/1
N2 - Multi-wire EDM slicing method have been developed to overcome problems of multi-wire saw method, and high-efficient and high-accurate slicing could be expected compared with a single-wire EDM technologies. However, a multi-wire EDM slicing equipment becomes very complex in the case of an individual power supplying method with multiple power units and conductivity piece sets. This traditional method leads to difficulties in the preparation and a heavy load on the maintenance for a multi-wire EDM slicing equipment. Therefore, a group power supplying method was newly proposed to satisfy both processing efficiency and simplification of slicing equipment, since it can supply sufficient energy to multiple processing wire electrodes only using one conductivity piece set with one EDM power unit. When monocrystalline silicon ingot was sliced by using steel wire electrode of 120 μm with the group power supplying method, discharge current per wire ideally changed with number of processing wire electrodes. However, kerf width was approximately constant at almost constant cutting speed regardless of number of processing wire electrodes. In addition, diameter of crater caused by electrical discharge pulse was dependent on the peak discharge current per wire rather than the total peak discharge current. These results indicate that input energies were almost constant at each processing wire electrode, and electrical discharge pulses could be homogeneously distributed to each processing wire electrode without the breakage even by using only one conductivity piece set in the group power supplying method.
AB - Multi-wire EDM slicing method have been developed to overcome problems of multi-wire saw method, and high-efficient and high-accurate slicing could be expected compared with a single-wire EDM technologies. However, a multi-wire EDM slicing equipment becomes very complex in the case of an individual power supplying method with multiple power units and conductivity piece sets. This traditional method leads to difficulties in the preparation and a heavy load on the maintenance for a multi-wire EDM slicing equipment. Therefore, a group power supplying method was newly proposed to satisfy both processing efficiency and simplification of slicing equipment, since it can supply sufficient energy to multiple processing wire electrodes only using one conductivity piece set with one EDM power unit. When monocrystalline silicon ingot was sliced by using steel wire electrode of 120 μm with the group power supplying method, discharge current per wire ideally changed with number of processing wire electrodes. However, kerf width was approximately constant at almost constant cutting speed regardless of number of processing wire electrodes. In addition, diameter of crater caused by electrical discharge pulse was dependent on the peak discharge current per wire rather than the total peak discharge current. These results indicate that input energies were almost constant at each processing wire electrode, and electrical discharge pulses could be homogeneously distributed to each processing wire electrode without the breakage even by using only one conductivity piece set in the group power supplying method.
KW - Group power supplying method
KW - Multi-wire
KW - Semiconductor
KW - Silicon
KW - Slicing
KW - Wire EDM
UR - http://www.scopus.com/inward/record.url?scp=85028810821&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85028810821&partnerID=8YFLogxK
M3 - Conference contribution
SP - 183
EP - 184
BT - Proceedings of the 17th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2017
PB - euspen
ER -