| Original language | English |
|---|---|
| Pages (from-to) | 825-828 |
| Number of pages | 4 |
| Journal | Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering |
| Volume | 83 |
| Issue number | 9 |
| DOIs | |
| Publication status | Published - Jan 1 2017 |
Fingerprint
Keywords
- Electrical discharge machining
- Multi-slicing
- Multi-wire
- Semiconductor
- Wire edm
ASJC Scopus subject areas
- Mechanical Engineering
Cite this
Multi-slicing of semiconductors by wire electrical discharge machining technology. / Okamoto, Yasuhiro; Okada, Akira.
In: Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering, Vol. 83, No. 9, 01.01.2017, p. 825-828.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Multi-slicing of semiconductors by wire electrical discharge machining technology
AU - Okamoto, Yasuhiro
AU - Okada, Akira
PY - 2017/1/1
Y1 - 2017/1/1
KW - Electrical discharge machining
KW - Multi-slicing
KW - Multi-wire
KW - Semiconductor
KW - Wire edm
UR - http://www.scopus.com/inward/record.url?scp=85028833869&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85028833869&partnerID=8YFLogxK
U2 - 10.2493/jjspe.83.825
DO - 10.2493/jjspe.83.825
M3 - Article
AN - SCOPUS:85028833869
VL - 83
SP - 825
EP - 828
JO - Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
JF - Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
SN - 0912-0289
IS - 9
ER -