Multi-slicing of semiconductors by wire electrical discharge machining technology

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)825-828
Number of pages4
JournalSeimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Volume83
Issue number9
DOIs
Publication statusPublished - Jan 1 2017

Keywords

  • Electrical discharge machining
  • Multi-slicing
  • Multi-wire
  • Semiconductor
  • Wire edm

ASJC Scopus subject areas

  • Mechanical Engineering

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