@article{4299a29212bd474dad7321b0242b0ee1,
title = "Multi-slicing of semiconductors by wire electrical discharge machining technology",
keywords = "Electrical discharge machining, Multi-slicing, Multi-wire, Semiconductor, Wire edm",
author = "Yasuhiro Okamoto and Akira Okada",
year = "2017",
month = jan,
day = "1",
doi = "10.2493/jjspe.83.825",
language = "English",
volume = "83",
pages = "825--828",
journal = "Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering",
issn = "0912-0289",
publisher = "Japan Society for Precision Engineering",
number = "9",
}