Multi-slicing of semiconductors by wire electrical discharge machining technology

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)825-828
Number of pages4
JournalSeimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Volume83
Issue number9
DOIs
Publication statusPublished - Jan 1 2017

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Electric discharge machining
Wire
Semiconductor materials

Keywords

  • Electrical discharge machining
  • Multi-slicing
  • Multi-wire
  • Semiconductor
  • Wire edm

ASJC Scopus subject areas

  • Mechanical Engineering

Cite this

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title = "Multi-slicing of semiconductors by wire electrical discharge machining technology",
keywords = "Electrical discharge machining, Multi-slicing, Multi-wire, Semiconductor, Wire edm",
author = "Yasuhiro Okamoto and Akira Okada",
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day = "1",
doi = "10.2493/jjspe.83.825",
language = "English",
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journal = "Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering",
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JO - Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering

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