Monitoring of interface crack between solder ball and copper plate subjected to cyclic tensile loading under fluctuating temperature by direct current potential difference method

Naoya Tada, Yusuke Ezaki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)
Original languageEnglish
Title of host publication2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008
Pages232-235
Number of pages4
DOIs
Publication statusPublished - 2008
Event2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008 - Taipei, Taiwan, Province of China
Duration: Oct 22 2008Oct 24 2008

Other

Other2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008
CountryTaiwan, Province of China
CityTaipei
Period10/22/0810/24/08

Fingerprint

Soldering alloys
Cracks
Copper
Monitoring
Temperature

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Mechanical Engineering

Cite this

Monitoring of interface crack between solder ball and copper plate subjected to cyclic tensile loading under fluctuating temperature by direct current potential difference method. / Tada, Naoya; Ezaki, Yusuke.

2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008. 2008. p. 232-235 4784271.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Tada, N & Ezaki, Y 2008, Monitoring of interface crack between solder ball and copper plate subjected to cyclic tensile loading under fluctuating temperature by direct current potential difference method. in 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008., 4784271, pp. 232-235, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, Taipei, Taiwan, Province of China, 10/22/08. https://doi.org/10.1109/EMAP.2008.4784271
@inproceedings{c4755cf468c94c4ead1931d3fdc3f834,
title = "Monitoring of interface crack between solder ball and copper plate subjected to cyclic tensile loading under fluctuating temperature by direct current potential difference method",
author = "Naoya Tada and Yusuke Ezaki",
year = "2008",
doi = "10.1109/EMAP.2008.4784271",
language = "English",
isbn = "9781424436217",
pages = "232--235",
booktitle = "2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008",

}

TY - GEN

T1 - Monitoring of interface crack between solder ball and copper plate subjected to cyclic tensile loading under fluctuating temperature by direct current potential difference method

AU - Tada, Naoya

AU - Ezaki, Yusuke

PY - 2008

Y1 - 2008

UR - http://www.scopus.com/inward/record.url?scp=64049093360&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=64049093360&partnerID=8YFLogxK

U2 - 10.1109/EMAP.2008.4784271

DO - 10.1109/EMAP.2008.4784271

M3 - Conference contribution

AN - SCOPUS:64049093360

SN - 9781424436217

SP - 232

EP - 235

BT - 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008

ER -