Monitoring of interface crack between solder ball and copper plate subjected to cyclic tensile loading under fluctuating temperature by direct current potential difference method

Naoya Tada; Yusuke Ezaki

doi:10.1109/EMAP.2008.4784271

Monitoring of interface crack between solder ball and copper plate subjected to cyclic tensile loading under fluctuating temperature by direct current potential difference method

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008
Pages	232-235
Number of pages	4
DOIs	https://doi.org/10.1109/EMAP.2008.4784271
Publication status	Published - Dec 1 2008
Event	2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008 - Taipei, Taiwan, Province of China Duration: Oct 22 2008 → Oct 24 2008

Publication series

Name	2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008

Other

Other	2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008
Country/Territory	Taiwan, Province of China
City	Taipei
Period	10/22/08 → 10/24/08

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering
Mechanical Engineering

Access to Document

10.1109/EMAP.2008.4784271

Cite this

Tada, N., & Ezaki, Y. (2008). Monitoring of interface crack between solder ball and copper plate subjected to cyclic tensile loading under fluctuating temperature by direct current potential difference method. In 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008 (pp. 232-235). [4784271] (2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008). https://doi.org/10.1109/EMAP.2008.4784271

Monitoring of interface crack between solder ball and copper plate subjected to cyclic tensile loading under fluctuating temperature by direct current potential difference method. / Tada, Naoya; Ezaki, Yusuke.

2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008. 2008. p. 232-235 4784271 (2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Tada, N & Ezaki, Y 2008, Monitoring of interface crack between solder ball and copper plate subjected to cyclic tensile loading under fluctuating temperature by direct current potential difference method. in 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008., 4784271, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, pp. 232-235, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, Taipei, Taiwan, Province of China, 10/22/08. https://doi.org/10.1109/EMAP.2008.4784271

Tada N, Ezaki Y. Monitoring of interface crack between solder ball and copper plate subjected to cyclic tensile loading under fluctuating temperature by direct current potential difference method. In 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008. 2008. p. 232-235. 4784271. (2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008). doi: 10.1109/EMAP.2008.4784271

Tada, Naoya ; Ezaki, Yusuke. / Monitoring of interface crack between solder ball and copper plate subjected to cyclic tensile loading under fluctuating temperature by direct current potential difference method. 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008. 2008. pp. 232-235 (2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008).

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Monitoring of interface crack between solder ball and copper plate subjected to cyclic tensile loading under fluctuating temperature by direct current potential difference method

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Other

ASJC Scopus subject areas

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