Monitoring of interface crack between solder ball and copper plate subjected to cyclic tensile loading under fluctuating temperature by direct current potential difference method

Naoya Tada, Yusuke Ezaki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)
Original languageEnglish
Title of host publication2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008
Pages232-235
Number of pages4
DOIs
Publication statusPublished - Dec 1 2008
Event2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008 - Taipei, Taiwan, Province of China
Duration: Oct 22 2008Oct 24 2008

Publication series

Name2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008

Other

Other2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008
CountryTaiwan, Province of China
CityTaipei
Period10/22/0810/24/08

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Mechanical Engineering

Cite this

Tada, N., & Ezaki, Y. (2008). Monitoring of interface crack between solder ball and copper plate subjected to cyclic tensile loading under fluctuating temperature by direct current potential difference method. In 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008 (pp. 232-235). [4784271] (2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008). https://doi.org/10.1109/EMAP.2008.4784271