TY - GEN
T1 - Modeling of microcontroller with multiple power supply pins for conducted EMI simulations
AU - Iokibe, Kengo
AU - Higashi, Ryota
AU - Tsuda, Takahiro
AU - Ichikawa, Kouji
AU - Nakamura, Katsumi
AU - Toyota, Yoshitaka
AU - Koga, Ryuji
PY - 2008
Y1 - 2008
N2 - An EMC macro-model of a 16-bit microcontroller with multiple-power-supply pins has been proposed for estimating the conducted EMI from a power-supply network. The macro-model, called the linear equivalent circuit and current sources (LECCS) model, is composed of multiple circuit blocks and multiple current sources corresponding to the composition of the chip circuits in the microcontroller, i.e., a current source for a circuit block. A current source statistically expresses the total RF current occurring in the corresponding circuit block. We confirmed that the proposed model could correctly estimate the RF power-supply currents under different decoupling conditions up to 300 MHz. We also found that a linear circuit of the regulator between the I/O and core circuit blocks could express the RF coupling between the two blocks.
AB - An EMC macro-model of a 16-bit microcontroller with multiple-power-supply pins has been proposed for estimating the conducted EMI from a power-supply network. The macro-model, called the linear equivalent circuit and current sources (LECCS) model, is composed of multiple circuit blocks and multiple current sources corresponding to the composition of the chip circuits in the microcontroller, i.e., a current source for a circuit block. A current source statistically expresses the total RF current occurring in the corresponding circuit block. We confirmed that the proposed model could correctly estimate the RF power-supply currents under different decoupling conditions up to 300 MHz. We also found that a linear circuit of the regulator between the I/O and core circuit blocks could express the RF coupling between the two blocks.
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U2 - 10.1109/EDAPS.2008.4736018
DO - 10.1109/EDAPS.2008.4736018
M3 - Conference contribution
AN - SCOPUS:60649103402
SN - 9781424426331
T3 - 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings
SP - 135
EP - 138
BT - 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings
T2 - 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008
Y2 - 10 December 2008 through 12 December 2008
ER -