Modeling of microcontroller with multiple power supply pins for conducted EMI simulations

Kengo Iokibe, Ryota Higashi, Takahiro Tsuda, Kouji Ichikawa, Katsumi Nakamura, Yoshitaka Toyota, Ryuji Koga

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

An EMC macro-model of a 16-bit microcontroller with multiple-power-supply pins has been proposed for estimating the conducted EMI from a power-supply network. The macro-model, called the linear equivalent circuit and current sources (LECCS) model, is composed of multiple circuit blocks and multiple current sources corresponding to the composition of the chip circuits in the microcontroller, i.e., a current source for a circuit block. A current source statistically expresses the total RF current occurring in the corresponding circuit block. We confirmed that the proposed model could correctly estimate the RF power-supply currents under different decoupling conditions up to 300 MHz. We also found that a linear circuit of the regulator between the I/O and core circuit blocks could express the RF coupling between the two blocks.

Original languageEnglish
Title of host publication2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings
Pages135-138
Number of pages4
DOIs
Publication statusPublished - Dec 1 2008
Event2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Seoul, Korea, Republic of
Duration: Dec 10 2008Dec 12 2008

Publication series

Name2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings

Other

Other2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008
CountryKorea, Republic of
CitySeoul
Period12/10/0812/12/08

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ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Iokibe, K., Higashi, R., Tsuda, T., Ichikawa, K., Nakamura, K., Toyota, Y., & Koga, R. (2008). Modeling of microcontroller with multiple power supply pins for conducted EMI simulations. In 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings (pp. 135-138). [4736018] (2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings). https://doi.org/10.1109/EDAPS.2008.4736018