Modeling and simulation of via-connected power bus stacks in multilayer PCBs

Zhi Liang Wang, Osami Wada, Takashi Harada, Takahiro Yaguchi, Yoshitaka Toyota, Ryuji Koga

Research output: Contribution to journalArticle

Fingerprint Dive into the research topics of 'Modeling and simulation of via-connected power bus stacks in multilayer PCBs'. Together they form a unique fingerprint.

Engineering & Materials Science