Modeling and simulation of via-connected power bus stacks in multilayer PCBs

Zhi Liang Wang, Osami Wada, Takashi Harada, Takahiro Yaguchi, Yoshitaka Toyota, Ryuji Koga

Research output: Contribution to journalArticlepeer-review

Abstract

Power bus noise problem has become a major concern for both EMC engineers and board designers. A fast algorithm, based on the cavity-mode model, was employed for analyzing resonance characteristics of multilayer power bus stacks interconnected by vias. The via is modeled as an inductance and its value is given by a simple expression. Good agreement between the simulated results and measurements demonstrates the effectiveness of the cavity-mode model, together with the via model.

Original languageEnglish
Pages (from-to)3176-3181
Number of pages6
JournalIEICE Transactions on Communications
VolumeE88-B
Issue number8
DOIs
Publication statusPublished - Aug 2005

Keywords

  • Cavity-mode model
  • EMI
  • Power bus stack and modeling
  • Via interconnect

ASJC Scopus subject areas

  • Software
  • Computer Networks and Communications
  • Electrical and Electronic Engineering

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