Miniaturization of a planar EBG structure using interdigital electrodes

Yuki Yamashita, Yoshitaka Toyota, Kengo Iokibe, Koichi Kondo, Shigeyoshi Yoshida, Toshiyuki Kaneko

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper describes a proposed planar electromagnetic bandgap (EBG) structure whose unit cell size is miniaturized through the use of interdigital electrodes (IDEs). For planar EBG structures in general, it is difficult to miniaturize the cell size independently of stopband frequency because the stopband frequency depends on the cell size. For the proposed structure, however, the cell size can be miniaturized because the IDEs help enlarge the capacitance between adjacent unit cells and utilize a resonator formed in the unit cells. Because the resonator's resonant frequency determines the stopband frequency of an EBG structure with IDEs, the cell size can be miniaturized independently of the stopband frequency. In the work described in this paper, the proposed EBG structure's efficacy in reducing power bus noise was examined and evaluated through full-wave simulation and measurement in the wireless communication band. It was found that an IDE-EBG structure with a small (25 mm2) unit cell is a valid means for achieving power bus noise reduction.

Original languageEnglish
Title of host publication2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages39-42
Number of pages4
ISBN (Print)9781467380997
DOIs
Publication statusPublished - Jan 14 2016
EventIEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015 - Seoul, Korea, Republic of
Duration: Dec 14 2015Dec 16 2015

Other

OtherIEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015
CountryKorea, Republic of
CitySeoul
Period12/14/1512/16/15

Fingerprint

Energy gap
Electrodes
Resonators
Noise abatement
Natural frequencies
Capacitance
Communication

Keywords

  • electromagnetic bandgap
  • interdigital electrode
  • noise reduction
  • parallel plate resonance
  • power bus
  • printed circuit board

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Yamashita, Y., Toyota, Y., Iokibe, K., Kondo, K., Yoshida, S., & Kaneko, T. (2016). Miniaturization of a planar EBG structure using interdigital electrodes. In 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015 (pp. 39-42). [7383703] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EDAPS.2015.7383703

Miniaturization of a planar EBG structure using interdigital electrodes. / Yamashita, Yuki; Toyota, Yoshitaka; Iokibe, Kengo; Kondo, Koichi; Yoshida, Shigeyoshi; Kaneko, Toshiyuki.

2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015. Institute of Electrical and Electronics Engineers Inc., 2016. p. 39-42 7383703.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Yamashita, Y, Toyota, Y, Iokibe, K, Kondo, K, Yoshida, S & Kaneko, T 2016, Miniaturization of a planar EBG structure using interdigital electrodes. in 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015., 7383703, Institute of Electrical and Electronics Engineers Inc., pp. 39-42, IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, Seoul, Korea, Republic of, 12/14/15. https://doi.org/10.1109/EDAPS.2015.7383703
Yamashita Y, Toyota Y, Iokibe K, Kondo K, Yoshida S, Kaneko T. Miniaturization of a planar EBG structure using interdigital electrodes. In 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015. Institute of Electrical and Electronics Engineers Inc. 2016. p. 39-42. 7383703 https://doi.org/10.1109/EDAPS.2015.7383703
Yamashita, Yuki ; Toyota, Yoshitaka ; Iokibe, Kengo ; Kondo, Koichi ; Yoshida, Shigeyoshi ; Kaneko, Toshiyuki. / Miniaturization of a planar EBG structure using interdigital electrodes. 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015. Institute of Electrical and Electronics Engineers Inc., 2016. pp. 39-42
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