Microscopic deformation of polycrystalline pure copper wire during tension

Naoya Tada, Yoshitaka Matsukawa, Takeshi Uemori, Toshiya Nakata

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

In order to clarify the inhomogeneous deformation of thin copper wire, an interrupted tensile test was carried out on the stage of the digital holographic microscope (DHM). The inhomogeneity was evaluated based on the non-uniform change in height distribution on the surface of thin wire specimen during the test. Microscopic plastic deformation by a unit of crystal grain and large gradient in height distribution along grain boundaries were observed. The increase in average height of grain between two earlier loading steps corresponded to that between two later loading steps. This result suggests that the microscopic deformation at the latter stage of tension is predictable from that at the early stage of the tension.

Original languageEnglish
Title of host publication2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages229-232
Number of pages4
ISBN (Print)9781467383561
DOIs
Publication statusPublished - Dec 23 2015
Event10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Taipei, Taiwan, Province of China
Duration: Oct 21 2015Oct 23 2015

Other

Other10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015
CountryTaiwan, Province of China
CityTaipei
Period10/21/1510/23/15

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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    Tada, N., Matsukawa, Y., Uemori, T., & Nakata, T. (2015). Microscopic deformation of polycrystalline pure copper wire during tension. In 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings (pp. 229-232). [7365226] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IMPACT.2015.7365226