Metallic Binary Copper Chalcogenides with Orthorhombic Layered Structure

Kaya Kobayashi, Shinya Kawamoto, Jun Akimitsu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)


Chalcogenide materials have regained attention after the recent recognition of the compatibility of transition metal dichalcogenides with graphene. Additionally, there has been a recent appreciation for the rich variety of properties they support due to the anomalies in the materials' intrinsic band structure. These materials generally have layered structures and weak interlayer connection through the chalcogen layer and its van der Waals type bonding. We have synthesized orthorhombic copper telluride and measured its electrical transport properties. The results of these measurements reveal that the conduction is metallic in both the in-plane and out-of-plane directions. The range of stability of this structure is examined along with the lattice constants. The independence of the resistivity in samples to changes in excess copper indicates that the transport is essentially within the conducting planes. This result shows that the material hosts two-dimensional character likely due to its covalent interlayer bonding.

Original languageEnglish
Title of host publicationMaterials Research Society Symposium Proceedings
EditorsS. Kar, J. Cheon, M. Terrones, M. Bar-Sadan
PublisherMaterials Research Society
ISBN (Print)9780000000002
Publication statusPublished - 2015
Externally publishedYes
EventMaterials Research Society Fall Meeting and Exhibit, 2014 - Boston, United States
Duration: Nov 30 2014Dec 5 2014

Publication series

NameMaterials Research Society Symposium Proceedings
ISSN (Print)0272-9172


OtherMaterials Research Society Fall Meeting and Exhibit, 2014
Country/TerritoryUnited States


  • crystallographic structure
  • electrical properties
  • layered

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


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