Metal Microcapsules Prepared via Electroless Plating at Liquid-Liquid Interface

Toshihiko Tsuneyoshi, Yunlong Cui, Hiroaki Ishida, Takaichi Watanabe, Tsutomu Ono

Research output: Contribution to journalArticle

Abstract

We report the facile preparation of metal microcapsules via the formation of a Pickering emulsion, stabilized by catalytic palladium nanoparticles (PdNPs), and subsequent electroless plating at an oil-water interface induced by the adsorbed PdNPs. Metal microcapsules with smooth metal shells are formed by simply agitating the mixture of the plating solution and 1,2-dichloroethane containing poly(vinylpyrrolidone)-coated PdNPs, without external heating or electrical sources as energy inputs. We found that the metal microcapsules had thin copper metal shells with a relatively smooth surface and metallic luster. The metal shells were composed of more than 99 atom % copper in the form of Cu and Cu2O. We believe that this simple metal microcapsule preparation method may be beneficial to produce novel functional microcapsules with metal shells.

Original languageEnglish
Pages (from-to)13311-13317
Number of pages7
JournalLangmuir
Volume35
Issue number41
DOIs
Publication statusPublished - Oct 15 2019

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metal shells
liquid-liquid interfaces
Electroless plating
plating
Capsules
Metals
palladium
Liquids
metals
nanoparticles
Palladium
luster
copper
preparation
Nanoparticles
emulsions
Copper
oils
heating
Emulsions

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Spectroscopy
  • Electrochemistry

Cite this

Metal Microcapsules Prepared via Electroless Plating at Liquid-Liquid Interface. / Tsuneyoshi, Toshihiko; Cui, Yunlong; Ishida, Hiroaki; Watanabe, Takaichi; Ono, Tsutomu.

In: Langmuir, Vol. 35, No. 41, 15.10.2019, p. 13311-13317.

Research output: Contribution to journalArticle

Tsuneyoshi, Toshihiko ; Cui, Yunlong ; Ishida, Hiroaki ; Watanabe, Takaichi ; Ono, Tsutomu. / Metal Microcapsules Prepared via Electroless Plating at Liquid-Liquid Interface. In: Langmuir. 2019 ; Vol. 35, No. 41. pp. 13311-13317.
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