Metal deposition deep into microstructure by electroless plating

Nobuyuki Takeyasu; Takuo Tanaka; Satoshi Kawata

doi:10.1143/JJAP.44.L1134

Metal deposition deep into microstructure by electroless plating

Nobuyuki Takeyasu, Takuo Tanaka, Satoshi Kawata

Research output: Contribution to journal › Article › peer-review

53 Citations (Scopus)

Abstract

It is generally difficult to deposit metal on an occluded part of a structure or inside a long tubular structure. In this paper, we report an electroless plating method that is useful for metal deposition onto internal obscured regions of a complex structure, and we show that the technique can deposit metal over a wide area. We demonstrate gold deposition inside a capillary tube and a complex concave structure of micrometer scale consisting of polystyrene microbeads sandwiched between glass plates.

Original language	English
Pages (from-to)	L1134-L1137
Journal	Japanese Journal of Applied Physics, Part 2: Letters
Volume	44
Issue number	33-36
DOIs	https://doi.org/10.1143/JJAP.44.L1134
Publication status	Published - Aug 26 2005
Externally published	Yes

Keywords

3D microstructure
Electroless plating
Gold
Latex beads
Metal coating
Silver

ASJC Scopus subject areas

Engineering(all)
Physics and Astronomy (miscellaneous)
Physics and Astronomy(all)

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10.1143/JJAP.44.L1134

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@article{880370a4e4254582b570262e3fb122bd,

title = "Metal deposition deep into microstructure by electroless plating",

abstract = "It is generally difficult to deposit metal on an occluded part of a structure or inside a long tubular structure. In this paper, we report an electroless plating method that is useful for metal deposition onto internal obscured regions of a complex structure, and we show that the technique can deposit metal over a wide area. We demonstrate gold deposition inside a capillary tube and a complex concave structure of micrometer scale consisting of polystyrene microbeads sandwiched between glass plates.",

keywords = "3D microstructure, Electroless plating, Gold, Latex beads, Metal coating, Silver",

author = "Nobuyuki Takeyasu and Takuo Tanaka and Satoshi Kawata",

year = "2005",

month = aug,

day = "26",

doi = "10.1143/JJAP.44.L1134",

language = "English",

volume = "44",

pages = "L1134--L1137",

journal = "Japanese Journal of Applied Physics, Part 2: Letters",

issn = "0021-4922",

number = "33-36",

}

TY - JOUR

T1 - Metal deposition deep into microstructure by electroless plating

AU - Takeyasu, Nobuyuki

AU - Tanaka, Takuo

AU - Kawata, Satoshi

PY - 2005/8/26

Y1 - 2005/8/26

N2 - It is generally difficult to deposit metal on an occluded part of a structure or inside a long tubular structure. In this paper, we report an electroless plating method that is useful for metal deposition onto internal obscured regions of a complex structure, and we show that the technique can deposit metal over a wide area. We demonstrate gold deposition inside a capillary tube and a complex concave structure of micrometer scale consisting of polystyrene microbeads sandwiched between glass plates.

AB - It is generally difficult to deposit metal on an occluded part of a structure or inside a long tubular structure. In this paper, we report an electroless plating method that is useful for metal deposition onto internal obscured regions of a complex structure, and we show that the technique can deposit metal over a wide area. We demonstrate gold deposition inside a capillary tube and a complex concave structure of micrometer scale consisting of polystyrene microbeads sandwiched between glass plates.

KW - 3D microstructure

KW - Electroless plating

KW - Gold

KW - Latex beads

KW - Metal coating

KW - Silver

UR - http://www.scopus.com/inward/record.url?scp=31144467691&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=31144467691&partnerID=8YFLogxK

U2 - 10.1143/JJAP.44.L1134

DO - 10.1143/JJAP.44.L1134

M3 - Article

AN - SCOPUS:31144467691

VL - 44

SP - L1134-L1137

JO - Japanese Journal of Applied Physics, Part 2: Letters

JF - Japanese Journal of Applied Physics, Part 2: Letters

SN - 0021-4922

IS - 33-36

ER -

Metal deposition deep into microstructure by electroless plating

Abstract

Keywords

ASJC Scopus subject areas

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