Measurement of the common source inductance of typical switching device packages

Kyota Aikawa; Tomohumi Shiida; Ryunosuke Matsumoto; Kazuhiro Umetani; Eiji Hiraki

doi:10.1109/IFEEC.2017.7992207

Measurement of the common source inductance of typical switching device packages

Kyota Aikawa, Tomohumi Shiida, Ryunosuke Matsumoto, Kazuhiro Umetani, Eiji Hiraki

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

10 Citations (Scopus)

Abstract

The common source inductance is one of the major causes of deterioration of the switching speed and susceptibility of the false triggering for semiconductor switching devices. Practical design of this inductance requires selection of an appropriate semiconductor package because this inductance is greatly dependent on the physical package structure. However, few studies have reported a list of the common source inductance of commercially available packages. In order to list and compare the common source inductance among typical semiconductor packages, this paper carried out measurement of this inductance of actual switching devices mounted on experimental PCBs. This paper employed a recently proposed straightforward measurement technique directly applicable to switching devices mounted on PCBs. As a result, a basic database of the common source inductance of typical packages was presented. The common source inductance was found to be determined mainly by the package type. However, in TO-247 and TO-220 packages, approximately one-third of the total common source inductance was found to possibly vary among the switching devices of the same package due to the dependence on the current rating. Investigation of the physical package structure implied that this dependence was caused by the stray inductance of the bonding wires connecting the semiconductor chip to the source terminal.

Original language	English
Title of host publication	2017 IEEE 3rd International Future Energy Electronics Conference and ECCE Asia, IFEEC - ECCE Asia 2017
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1172-1177
Number of pages	6
ISBN (Electronic)	9781509051571
DOIs	https://doi.org/10.1109/IFEEC.2017.7992207
Publication status	Published - Jul 25 2017
Event	3rd IEEE International Future Energy Electronics Conference and ECCE Asia, IFEEC - ECCE Asia 2017 - Kaohsiung, Taiwan, Province of China Duration: Jun 3 2017 → Jun 7 2017

Other

Other	3rd IEEE International Future Energy Electronics Conference and ECCE Asia, IFEEC - ECCE Asia 2017
Country	Taiwan, Province of China
City	Kaohsiung
Period	6/3/17 → 6/7/17

Keywords

bonding wire
common source inductance
semiconductor package
stray inductance

ASJC Scopus subject areas

Energy Engineering and Power Technology
Electrical and Electronic Engineering
Control and Optimization

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10.1109/IFEEC.2017.7992207

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Aikawa, K., Shiida, T., Matsumoto, R., Umetani, K., & Hiraki, E. (2017). Measurement of the common source inductance of typical switching device packages. In 2017 IEEE 3rd International Future Energy Electronics Conference and ECCE Asia, IFEEC - ECCE Asia 2017 (pp. 1172-1177). [7992207] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IFEEC.2017.7992207

Measurement of the common source inductance of typical switching device packages. / Aikawa, Kyota; Shiida, Tomohumi; Matsumoto, Ryunosuke; Umetani, Kazuhiro ; Hiraki, Eiji.

2017 IEEE 3rd International Future Energy Electronics Conference and ECCE Asia, IFEEC - ECCE Asia 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 1172-1177 7992207.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Aikawa, K, Shiida, T, Matsumoto, R, Umetani, K & Hiraki, E 2017, Measurement of the common source inductance of typical switching device packages. in 2017 IEEE 3rd International Future Energy Electronics Conference and ECCE Asia, IFEEC - ECCE Asia 2017., 7992207, Institute of Electrical and Electronics Engineers Inc., pp. 1172-1177, 3rd IEEE International Future Energy Electronics Conference and ECCE Asia, IFEEC - ECCE Asia 2017, Kaohsiung, Taiwan, Province of China, 6/3/17. https://doi.org/10.1109/IFEEC.2017.7992207

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AB - The common source inductance is one of the major causes of deterioration of the switching speed and susceptibility of the false triggering for semiconductor switching devices. Practical design of this inductance requires selection of an appropriate semiconductor package because this inductance is greatly dependent on the physical package structure. However, few studies have reported a list of the common source inductance of commercially available packages. In order to list and compare the common source inductance among typical semiconductor packages, this paper carried out measurement of this inductance of actual switching devices mounted on experimental PCBs. This paper employed a recently proposed straightforward measurement technique directly applicable to switching devices mounted on PCBs. As a result, a basic database of the common source inductance of typical packages was presented. The common source inductance was found to be determined mainly by the package type. However, in TO-247 and TO-220 packages, approximately one-third of the total common source inductance was found to possibly vary among the switching devices of the same package due to the dependence on the current rating. Investigation of the physical package structure implied that this dependence was caused by the stray inductance of the bonding wires connecting the semiconductor chip to the source terminal.

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