Abstract
The common source inductance is one of the major causes of deterioration of the switching speed and susceptibility of the false triggering for semiconductor switching devices. Practical design of this inductance requires selection of an appropriate semiconductor package because this inductance is greatly dependent on the physical package structure. However, few studies have reported a list of the common source inductance of commercially available packages. In order to list and compare the common source inductance among typical semiconductor packages, this paper carried out measurement of this inductance of actual switching devices mounted on experimental PCBs. This paper employed a recently proposed straightforward measurement technique directly applicable to switching devices mounted on PCBs. As a result, a basic database of the common source inductance of typical packages was presented. The common source inductance was found to be determined mainly by the package type. However, in TO-247 and TO-220 packages, approximately one-third of the total common source inductance was found to possibly vary among the switching devices of the same package due to the dependence on the current rating. Investigation of the physical package structure implied that this dependence was caused by the stray inductance of the bonding wires connecting the semiconductor chip to the source terminal.
| Original language | English |
|---|---|
| Title of host publication | 2017 IEEE 3rd International Future Energy Electronics Conference and ECCE Asia, IFEEC - ECCE Asia 2017 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 1172-1177 |
| Number of pages | 6 |
| ISBN (Electronic) | 9781509051571 |
| DOIs | |
| Publication status | Published - Jul 25 2017 |
| Event | 3rd IEEE International Future Energy Electronics Conference and ECCE Asia, IFEEC - ECCE Asia 2017 - Kaohsiung, Taiwan, Province of China Duration: Jun 3 2017 → Jun 7 2017 |
Other
| Other | 3rd IEEE International Future Energy Electronics Conference and ECCE Asia, IFEEC - ECCE Asia 2017 |
|---|---|
| Country | Taiwan, Province of China |
| City | Kaohsiung |
| Period | 6/3/17 → 6/7/17 |
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Keywords
- bonding wire
- common source inductance
- semiconductor package
- stray inductance
ASJC Scopus subject areas
- Energy Engineering and Power Technology
- Electrical and Electronic Engineering
- Control and Optimization
Cite this
Measurement of the common source inductance of typical switching device packages. / Aikawa, Kyota; Shiida, Tomohumi; Matsumoto, Ryunosuke; Umetani, Kazuhiro; Hiraki, Eiji.
2017 IEEE 3rd International Future Energy Electronics Conference and ECCE Asia, IFEEC - ECCE Asia 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 1172-1177 7992207.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Measurement of the common source inductance of typical switching device packages
AU - Aikawa, Kyota
AU - Shiida, Tomohumi
AU - Matsumoto, Ryunosuke
AU - Umetani, Kazuhiro
AU - Hiraki, Eiji
PY - 2017/7/25
Y1 - 2017/7/25
N2 - The common source inductance is one of the major causes of deterioration of the switching speed and susceptibility of the false triggering for semiconductor switching devices. Practical design of this inductance requires selection of an appropriate semiconductor package because this inductance is greatly dependent on the physical package structure. However, few studies have reported a list of the common source inductance of commercially available packages. In order to list and compare the common source inductance among typical semiconductor packages, this paper carried out measurement of this inductance of actual switching devices mounted on experimental PCBs. This paper employed a recently proposed straightforward measurement technique directly applicable to switching devices mounted on PCBs. As a result, a basic database of the common source inductance of typical packages was presented. The common source inductance was found to be determined mainly by the package type. However, in TO-247 and TO-220 packages, approximately one-third of the total common source inductance was found to possibly vary among the switching devices of the same package due to the dependence on the current rating. Investigation of the physical package structure implied that this dependence was caused by the stray inductance of the bonding wires connecting the semiconductor chip to the source terminal.
AB - The common source inductance is one of the major causes of deterioration of the switching speed and susceptibility of the false triggering for semiconductor switching devices. Practical design of this inductance requires selection of an appropriate semiconductor package because this inductance is greatly dependent on the physical package structure. However, few studies have reported a list of the common source inductance of commercially available packages. In order to list and compare the common source inductance among typical semiconductor packages, this paper carried out measurement of this inductance of actual switching devices mounted on experimental PCBs. This paper employed a recently proposed straightforward measurement technique directly applicable to switching devices mounted on PCBs. As a result, a basic database of the common source inductance of typical packages was presented. The common source inductance was found to be determined mainly by the package type. However, in TO-247 and TO-220 packages, approximately one-third of the total common source inductance was found to possibly vary among the switching devices of the same package due to the dependence on the current rating. Investigation of the physical package structure implied that this dependence was caused by the stray inductance of the bonding wires connecting the semiconductor chip to the source terminal.
KW - bonding wire
KW - common source inductance
KW - semiconductor package
KW - stray inductance
UR - http://www.scopus.com/inward/record.url?scp=85034029363&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85034029363&partnerID=8YFLogxK
U2 - 10.1109/IFEEC.2017.7992207
DO - 10.1109/IFEEC.2017.7992207
M3 - Conference contribution
AN - SCOPUS:85034029363
SP - 1172
EP - 1177
BT - 2017 IEEE 3rd International Future Energy Electronics Conference and ECCE Asia, IFEEC - ECCE Asia 2017
PB - Institute of Electrical and Electronics Engineers Inc.
ER -