Long-wavelength ultrafast monolithic receiver OEIC

Kiyoto Takahata, Yoshifumi Muramoto, Hideki Fukano, Shunji Kimura

Research output: Contribution to journalArticle

Abstract

A long-wavelength monolithic photoreceiver was fabricated using a multimode waveguide pin photodiode (WGPD) and a distributed amplifier. Although the receiver OEIC (Opto-Electronic Integrated Circuit) consists of 0.5-μm gate-length HEMTs with modest cutoff frequencies fT/fmax of 55/130 GHz, it provides a large bandwidth of 52 GHz because of the loss-compensation circuit construction. The receiver OEIC provides an excellent optical/electrical conversion factor of 125 V/W mainly because of the high responsivity of the multimode WGPD. It also shows a clear eye opening at 40 Gbit/s with an output voltage of 1 Vp-p.

Original languageEnglish
Pages (from-to)546-552
Number of pages7
JournalNTT R and D
Volume49
Issue number9
Publication statusPublished - 2000
Externally publishedYes

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Integrated optoelectronics
Photodiodes
Waveguides
Wavelength
Cutoff frequency
High electron mobility transistors
Bandwidth
Networks (circuits)
Electric potential
Compensation and Redress

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Takahata, K., Muramoto, Y., Fukano, H., & Kimura, S. (2000). Long-wavelength ultrafast monolithic receiver OEIC. NTT R and D, 49(9), 546-552.

Long-wavelength ultrafast monolithic receiver OEIC. / Takahata, Kiyoto; Muramoto, Yoshifumi; Fukano, Hideki; Kimura, Shunji.

In: NTT R and D, Vol. 49, No. 9, 2000, p. 546-552.

Research output: Contribution to journalArticle

Takahata, K, Muramoto, Y, Fukano, H & Kimura, S 2000, 'Long-wavelength ultrafast monolithic receiver OEIC', NTT R and D, vol. 49, no. 9, pp. 546-552.
Takahata K, Muramoto Y, Fukano H, Kimura S. Long-wavelength ultrafast monolithic receiver OEIC. NTT R and D. 2000;49(9):546-552.
Takahata, Kiyoto ; Muramoto, Yoshifumi ; Fukano, Hideki ; Kimura, Shunji. / Long-wavelength ultrafast monolithic receiver OEIC. In: NTT R and D. 2000 ; Vol. 49, No. 9. pp. 546-552.
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