Investigation on micro-machining characteristics and phenomenon of semiconductor materials by harmonics of Nd:YAG laser

Takayuki Hirano, Yasuhiro Okamoto, Akira Okada, Yoshiyuki Uno, Tomokazu Sakagawa, Shin Ichi Nakashiba

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Precision micro-machining without crack and heat affected zones is required in order to use high-performance materials such as silicon and silicon carbide, and it is expected that the higher harmonics of the Nd:YAG laser can perform precision micro-machining due to its high photon energy. However, even by using the harmonics of the Nd:YAG laser, a heat affected zone is inevitable due to the plasma generation. In order to reduce the influence of plasma on the processing results, it is important to understand the generation mechanism of plasma. Therefore, the laser induced plasma in micro-drilling of silicon carbide was observed by a high-speed shutter camera, and the influence of laser wavelength and surrounding conditions on the machining characteristics were experimentally investigated. The removal depth increased with decreasing wavelength and the surrounding gas pressure. The surface integrity was improved by the combination of shorter wavelength and reduced pressure conditions. The behavior of laser induced plasma was different from the wavelength of the laser beam and the surrounding gas pressure. Under atmospheric pressure conditions, the plasma grew greatly and affected the wider surface around the drilled hole with increasing wavelength. Under reduced pressure conditions, there was little difference in plasma size by wavelength, and the affected zone around the drilled hole became relatively smaller. It became clear that a low surrounding gas pressure and shorter wavelength were important to obtain better surface integrity and highly efficient processing.

Original languageEnglish
Title of host publicationProceedings of Precision Engineering and Nanotechnology
PublisherTrans Tech Publications Ltd
Pages36-41
Number of pages6
ISBN (Print)9783037854280
DOIs
Publication statusPublished - Jan 1 2012
Event4th International Conference of Asian Society for Precision Engineering and Nanotechnology, ASPEN 2011 - Hong Kong, China
Duration: Nov 16 2011Nov 18 2011

Publication series

NameKey Engineering Materials
Volume516
ISSN (Print)1013-9826
ISSN (Electronic)1662-9795

Other

Other4th International Conference of Asian Society for Precision Engineering and Nanotechnology, ASPEN 2011
CountryChina
CityHong Kong
Period11/16/1111/18/11

Keywords

  • Laser
  • Plasma behavior
  • Silicon carbide
  • Surrounding gas pressure
  • Wavelength

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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  • Cite this

    Hirano, T., Okamoto, Y., Okada, A., Uno, Y., Sakagawa, T., & Nakashiba, S. I. (2012). Investigation on micro-machining characteristics and phenomenon of semiconductor materials by harmonics of Nd:YAG laser. In Proceedings of Precision Engineering and Nanotechnology (pp. 36-41). (Key Engineering Materials; Vol. 516). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/KEM.516.36