Abstract
Precision micro-machining without crack and heat affected zones is required in order to use high-performance materials such as silicon and silicon carbide, and it is expected that the higher harmonics of the Nd:YAG laser can perform precision micro-machining due to its high photon energy. However, even by using the harmonics of the Nd:YAG laser, a heat affected zone is inevitable due to the plasma generation. In order to reduce the influence of plasma on the processing results, it is important to understand the generation mechanism of plasma. Therefore, the laser induced plasma in micro-drilling of silicon carbide was observed by a high-speed shutter camera, and the influence of laser wavelength and surrounding conditions on the machining characteristics were experimentally investigated. The removal depth increased with decreasing wavelength and the surrounding gas pressure. The surface integrity was improved by the combination of shorter wavelength and reduced pressure conditions. The behavior of laser induced plasma was different from the wavelength of the laser beam and the surrounding gas pressure. Under atmospheric pressure conditions, the plasma grew greatly and affected the wider surface around the drilled hole with increasing wavelength. Under reduced pressure conditions, there was little difference in plasma size by wavelength, and the affected zone around the drilled hole became relatively smaller. It became clear that a low surrounding gas pressure and shorter wavelength were important to obtain better surface integrity and highly efficient processing.
| Original language | English |
|---|---|
| Title of host publication | Key Engineering Materials |
| Pages | 36-41 |
| Number of pages | 6 |
| Volume | 516 |
| DOIs | |
| Publication status | Published - 2012 |
| Event | 4th International Conference of Asian Society for Precision Engineering and Nanotechnology, ASPEN 2011 - Hong Kong, China Duration: Nov 16 2011 → Nov 18 2011 |
Publication series
| Name | Key Engineering Materials |
|---|---|
| Volume | 516 |
| ISSN (Print) | 10139826 |
Other
| Other | 4th International Conference of Asian Society for Precision Engineering and Nanotechnology, ASPEN 2011 |
|---|---|
| Country | China |
| City | Hong Kong |
| Period | 11/16/11 → 11/18/11 |
Fingerprint
Keywords
- Laser
- Plasma behavior
- Silicon carbide
- Surrounding gas pressure
- Wavelength
ASJC Scopus subject areas
- Materials Science(all)
- Mechanics of Materials
- Mechanical Engineering
Cite this
Investigation on micro-machining characteristics and phenomenon of semiconductor materials by harmonics of Nd : YAG laser. / Hirano, Takayuki; Okamoto, Yasuhiro; Okada, Akira; Uno, Yoshiyuki; Sakagawa, Tomokazu; Nakashiba, Shin Ichi.
Key Engineering Materials. Vol. 516 2012. p. 36-41 (Key Engineering Materials; Vol. 516).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Investigation on micro-machining characteristics and phenomenon of semiconductor materials by harmonics of Nd
T2 - YAG laser
AU - Hirano, Takayuki
AU - Okamoto, Yasuhiro
AU - Okada, Akira
AU - Uno, Yoshiyuki
AU - Sakagawa, Tomokazu
AU - Nakashiba, Shin Ichi
PY - 2012
Y1 - 2012
N2 - Precision micro-machining without crack and heat affected zones is required in order to use high-performance materials such as silicon and silicon carbide, and it is expected that the higher harmonics of the Nd:YAG laser can perform precision micro-machining due to its high photon energy. However, even by using the harmonics of the Nd:YAG laser, a heat affected zone is inevitable due to the plasma generation. In order to reduce the influence of plasma on the processing results, it is important to understand the generation mechanism of plasma. Therefore, the laser induced plasma in micro-drilling of silicon carbide was observed by a high-speed shutter camera, and the influence of laser wavelength and surrounding conditions on the machining characteristics were experimentally investigated. The removal depth increased with decreasing wavelength and the surrounding gas pressure. The surface integrity was improved by the combination of shorter wavelength and reduced pressure conditions. The behavior of laser induced plasma was different from the wavelength of the laser beam and the surrounding gas pressure. Under atmospheric pressure conditions, the plasma grew greatly and affected the wider surface around the drilled hole with increasing wavelength. Under reduced pressure conditions, there was little difference in plasma size by wavelength, and the affected zone around the drilled hole became relatively smaller. It became clear that a low surrounding gas pressure and shorter wavelength were important to obtain better surface integrity and highly efficient processing.
AB - Precision micro-machining without crack and heat affected zones is required in order to use high-performance materials such as silicon and silicon carbide, and it is expected that the higher harmonics of the Nd:YAG laser can perform precision micro-machining due to its high photon energy. However, even by using the harmonics of the Nd:YAG laser, a heat affected zone is inevitable due to the plasma generation. In order to reduce the influence of plasma on the processing results, it is important to understand the generation mechanism of plasma. Therefore, the laser induced plasma in micro-drilling of silicon carbide was observed by a high-speed shutter camera, and the influence of laser wavelength and surrounding conditions on the machining characteristics were experimentally investigated. The removal depth increased with decreasing wavelength and the surrounding gas pressure. The surface integrity was improved by the combination of shorter wavelength and reduced pressure conditions. The behavior of laser induced plasma was different from the wavelength of the laser beam and the surrounding gas pressure. Under atmospheric pressure conditions, the plasma grew greatly and affected the wider surface around the drilled hole with increasing wavelength. Under reduced pressure conditions, there was little difference in plasma size by wavelength, and the affected zone around the drilled hole became relatively smaller. It became clear that a low surrounding gas pressure and shorter wavelength were important to obtain better surface integrity and highly efficient processing.
KW - Laser
KW - Plasma behavior
KW - Silicon carbide
KW - Surrounding gas pressure
KW - Wavelength
UR - http://www.scopus.com/inward/record.url?scp=84862729063&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84862729063&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/KEM.516.36
DO - 10.4028/www.scientific.net/KEM.516.36
M3 - Conference contribution
AN - SCOPUS:84862729063
SN - 9783037854280
VL - 516
T3 - Key Engineering Materials
SP - 36
EP - 41
BT - Key Engineering Materials
ER -