Investigation of optical interconnection by using photonic wire bonding

ZhiChen Gu, Tomohiro Amemiya, Atsushi Ishikawa, Yuki Atsumi, Joonhyun Kang, Takuo Hiratani, Yusuke Hayashi, Junichi Suzuki, Nobuhiko Nishiyama, Takuo Tanaka, Shigehisa Arai

Research output: Contribution to journal › Article

2 Citations (Scopus)

Abstract

Photonic wire bonding based on direct laser writing of three-dimensional polymer structure was discussed as one of practical approaches for photonic integration of heterogeneous optical components. Here we assessed the coupling efficiency between photonic wire bond and III-V/Si optical components, and demonstrate the fabrication of photonic wire bond between two III-V semiconductor chips.

Original languageEnglish
Pages (from-to)148-153
Number of pages6
JournalJournal of Laser Micro Nanoengineering
Volume10
Issue number2
DOIs
Publication statusPublished - 2015
Externally publishedYes

Fingerprint

Optical interconnects
Photonics
wire
Wire
photonics
chips
Fabrication
fabrication
Lasers
polymers
Polymers
lasers

Keywords

  • Direct laser writing
  • III-V semiconductor
  • Photonic integration
  • Photonic wire bonding
  • Si photonics

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Instrumentation
  • Electrical and Electronic Engineering

Cite this

Gu, Z., Amemiya, T., Ishikawa, A., Atsumi, Y., Kang, J., Hiratani, T., ... Arai, S. (2015). Investigation of optical interconnection by using photonic wire bonding. Journal of Laser Micro Nanoengineering, 10(2), 148-153. https://doi.org/10.2961/jlmn.2015.02.0007

Investigation of optical interconnection by using photonic wire bonding. / Gu, ZhiChen; Amemiya, Tomohiro; Ishikawa, Atsushi; Atsumi, Yuki; Kang, Joonhyun; Hiratani, Takuo; Hayashi, Yusuke; Suzuki, Junichi; Nishiyama, Nobuhiko; Tanaka, Takuo; Arai, Shigehisa.

In: Journal of Laser Micro Nanoengineering, Vol. 10, No. 2, 2015, p. 148-153.

Research output: Contribution to journal › Article

Gu, Z, Amemiya, T, Ishikawa, A, Atsumi, Y, Kang, J, Hiratani, T, Hayashi, Y, Suzuki, J, Nishiyama, N, Tanaka, T & Arai, S 2015, 'Investigation of optical interconnection by using photonic wire bonding', Journal of Laser Micro Nanoengineering, vol. 10, no. 2, pp. 148-153. https://doi.org/10.2961/jlmn.2015.02.0007
Gu Z, Amemiya T, Ishikawa A, Atsumi Y, Kang J, Hiratani T et al. Investigation of optical interconnection by using photonic wire bonding. Journal of Laser Micro Nanoengineering. 2015;10(2):148-153. https://doi.org/10.2961/jlmn.2015.02.0007
Gu, ZhiChen ; Amemiya, Tomohiro ; Ishikawa, Atsushi ; Atsumi, Yuki ; Kang, Joonhyun ; Hiratani, Takuo ; Hayashi, Yusuke ; Suzuki, Junichi ; Nishiyama, Nobuhiko ; Tanaka, Takuo ; Arai, Shigehisa. / Investigation of optical interconnection by using photonic wire bonding. In: Journal of Laser Micro Nanoengineering. 2015 ; Vol. 10, No. 2. pp. 148-153.
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AU - Hayashi, Yusuke

AU - Suzuki, Junichi

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