Investigation of optical interconnection by using photonic wire bonding

Zhi Chen Gu, Tomohiro Amemiya, Atsushi Ishikawa, Yuki Atsumi, Joonhyun Kang, Takuo Hiratani, Yusuke Hayashi, Junichi Suzuki, Nobuhiko Nishiyama, Takuo Tanaka, Shigehisa Arai

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

Photonic wire bonding based on direct laser writing of three-dimensional polymer structure was discussed as one of practical approaches for photonic integration of heterogeneous optical components. Here we assessed the coupling efficiency between photonic wire bond and III-V/Si optical components, and demonstrate the fabrication of photonic wire bond between two III-V semiconductor chips.

Original languageEnglish
Pages (from-to)148-153
Number of pages6
JournalJournal of Laser Micro Nanoengineering
Volume10
Issue number2
DOIs
Publication statusPublished - Jan 1 2015

Keywords

  • Direct laser writing
  • III-V semiconductor
  • Photonic integration
  • Photonic wire bonding
  • Si photonics

ASJC Scopus subject areas

  • Instrumentation
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Gu, Z. C., Amemiya, T., Ishikawa, A., Atsumi, Y., Kang, J., Hiratani, T., Hayashi, Y., Suzuki, J., Nishiyama, N., Tanaka, T., & Arai, S. (2015). Investigation of optical interconnection by using photonic wire bonding. Journal of Laser Micro Nanoengineering, 10(2), 148-153. https://doi.org/10.2961/jlmn.2015.02.0007