Abstract
Photonic wire bonding based on direct laser writing of three-dimensional polymer structure was discussed as one of practical approaches for photonic integration of heterogeneous optical components. Here we assessed the coupling efficiency between photonic wire bond and III-V/Si optical components, and demonstrate the fabrication of photonic wire bond between two III-V semiconductor chips.
Original language | English |
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Pages (from-to) | 148-153 |
Number of pages | 6 |
Journal | Journal of Laser Micro Nanoengineering |
Volume | 10 |
Issue number | 2 |
DOIs | |
Publication status | Published - 2015 |
Keywords
- Direct laser writing
- III-V semiconductor
- Photonic integration
- Photonic wire bonding
- Si photonics
ASJC Scopus subject areas
- Instrumentation
- Industrial and Manufacturing Engineering
- Electrical and Electronic Engineering