Investigation of optical interconnection by using photonic wire bonding

Zhi Chen Gu; Tomohiro Amemiya; Atsushi Ishikawa; Yuki Atsumi; Joonhyun Kang; Takuo Hiratani; Yusuke Hayashi; Junichi Suzuki; Nobuhiko Nishiyama; Takuo Tanaka; Shigehisa Arai

doi:10.2961/jlmn.2015.02.0007

Investigation of optical interconnection by using photonic wire bonding

Zhi Chen Gu, Tomohiro Amemiya, Atsushi Ishikawa, Yuki Atsumi, Joonhyun Kang, Takuo Hiratani, Yusuke Hayashi, Junichi Suzuki, Nobuhiko Nishiyama, Takuo Tanaka, Shigehisa Arai

Graduate School of Natural Science and Technology

Research output: Contribution to journal › Article › peer-review

2 Citations (Scopus)

Abstract

Photonic wire bonding based on direct laser writing of three-dimensional polymer structure was discussed as one of practical approaches for photonic integration of heterogeneous optical components. Here we assessed the coupling efficiency between photonic wire bond and III-V/Si optical components, and demonstrate the fabrication of photonic wire bond between two III-V semiconductor chips.

Original language	English
Pages (from-to)	148-153
Number of pages	6
Journal	Journal of Laser Micro Nanoengineering
Volume	10
Issue number	2
DOIs	https://doi.org/10.2961/jlmn.2015.02.0007
Publication status	Published - 2015

Keywords

Direct laser writing
III-V semiconductor
Photonic integration
Photonic wire bonding
Si photonics

ASJC Scopus subject areas

Instrumentation
Industrial and Manufacturing Engineering
Electrical and Electronic Engineering

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10.2961/jlmn.2015.02.0007

Cite this

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title = "Investigation of optical interconnection by using photonic wire bonding",

abstract = "Photonic wire bonding based on direct laser writing of three-dimensional polymer structure was discussed as one of practical approaches for photonic integration of heterogeneous optical components. Here we assessed the coupling efficiency between photonic wire bond and III-V/Si optical components, and demonstrate the fabrication of photonic wire bond between two III-V semiconductor chips.",

keywords = "Direct laser writing, III-V semiconductor, Photonic integration, Photonic wire bonding, Si photonics",

author = "Gu, {Zhi Chen} and Tomohiro Amemiya and Atsushi Ishikawa and Yuki Atsumi and Joonhyun Kang and Takuo Hiratani and Yusuke Hayashi and Junichi Suzuki and Nobuhiko Nishiyama and Takuo Tanaka and Shigehisa Arai",

year = "2015",

doi = "10.2961/jlmn.2015.02.0007",

language = "English",

volume = "10",

pages = "148--153",

journal = "Journal of Laser Micro Nanoengineering",

issn = "1880-0688",

publisher = "Japan Laser Processing",

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TY - JOUR

T1 - Investigation of optical interconnection by using photonic wire bonding

AU - Gu, Zhi Chen

AU - Amemiya, Tomohiro

AU - Ishikawa, Atsushi

AU - Atsumi, Yuki

AU - Kang, Joonhyun

AU - Hiratani, Takuo

AU - Hayashi, Yusuke

AU - Suzuki, Junichi

AU - Nishiyama, Nobuhiko

AU - Tanaka, Takuo

AU - Arai, Shigehisa

PY - 2015

Y1 - 2015

N2 - Photonic wire bonding based on direct laser writing of three-dimensional polymer structure was discussed as one of practical approaches for photonic integration of heterogeneous optical components. Here we assessed the coupling efficiency between photonic wire bond and III-V/Si optical components, and demonstrate the fabrication of photonic wire bond between two III-V semiconductor chips.

AB - Photonic wire bonding based on direct laser writing of three-dimensional polymer structure was discussed as one of practical approaches for photonic integration of heterogeneous optical components. Here we assessed the coupling efficiency between photonic wire bond and III-V/Si optical components, and demonstrate the fabrication of photonic wire bond between two III-V semiconductor chips.

KW - Direct laser writing

KW - III-V semiconductor

KW - Photonic integration

KW - Photonic wire bonding

KW - Si photonics

UR - http://www.scopus.com/inward/record.url?scp=84929331106&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84929331106&partnerID=8YFLogxK

U2 - 10.2961/jlmn.2015.02.0007

DO - 10.2961/jlmn.2015.02.0007

M3 - Article

AN - SCOPUS:84929331106

VL - 10

SP - 148

EP - 153

JO - Journal of Laser Micro Nanoengineering

JF - Journal of Laser Micro Nanoengineering

SN - 1880-0688

IS - 2

ER -

Investigation of optical interconnection by using photonic wire bonding

Abstract

Keywords

ASJC Scopus subject areas

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