Abstract
This paper describes micro-drilling processes for printed circuit boards (PCBs) containing fillers with high hardness and high thermal conductivity. Inspired primarily by devices such as digital cameras, laptop computers, and wireless communications devices, the electronics field today is continuously demanding smaller, lighter, and more technologically advanced high performance devices. However, that the increase in semiconductor-generated heat tends to affect such devices negatively. Additionally, from the viewpoint of environmental problems, electric vehicles and LEDs are being developed actively. PCBs are one of the principal components for building such devices. In recent years, PCBs containing alumina fillers with high thermal conductivity have been developed and begun to be widely used. However, when processing these PCBs, the drill tools become severely worn because of the filler's high hardness. We therefore examined the drill wear characteristics. The results show the filler is the main factor that causes drill wear, while the increase in cutting force does not affect it. The cutting force increases with the drill wear linearly. Moreover, the characteristic of PCBs with higher filler content rates is close to that of inorganic material like ceramics.
| Original language | English |
|---|---|
| Title of host publication | Advances in Abrasive Technology XV |
| Pages | 442-447 |
| Number of pages | 6 |
| Volume | 565 |
| DOIs | |
| Publication status | Published - 2012 |
| Externally published | Yes |
| Event | 15th International Symposium on Advances in Abrasive Technology, ISAAT 2012 - , Singapore Duration: Sep 25 2012 → Sep 28 2012 |
Publication series
| Name | Advanced Materials Research |
|---|---|
| Volume | 565 |
| ISSN (Print) | 1022-6680 |
Other
| Other | 15th International Symposium on Advances in Abrasive Technology, ISAAT 2012 |
|---|---|
| Country | Singapore |
| Period | 9/25/12 → 9/28/12 |
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Keywords
- Cutting force
- High hardness filler
- Micro-drilling
- Printed circuit boards
- Temperature
- Thrust
- Torque
ASJC Scopus subject areas
- Engineering(all)
Cite this
Investigation of micro-drilling for printed circuit boards containing high-hardness fillers. / Funabiki, Taiji; Hirogaki, Toshiki; Aoyama, Eiichi; Ogawa, Keiji; Kodama, Hiroyuki.
Advances in Abrasive Technology XV. Vol. 565 2012. p. 442-447 (Advanced Materials Research; Vol. 565).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Investigation of micro-drilling for printed circuit boards containing high-hardness fillers
AU - Funabiki, Taiji
AU - Hirogaki, Toshiki
AU - Aoyama, Eiichi
AU - Ogawa, Keiji
AU - Kodama, Hiroyuki
PY - 2012
Y1 - 2012
N2 - This paper describes micro-drilling processes for printed circuit boards (PCBs) containing fillers with high hardness and high thermal conductivity. Inspired primarily by devices such as digital cameras, laptop computers, and wireless communications devices, the electronics field today is continuously demanding smaller, lighter, and more technologically advanced high performance devices. However, that the increase in semiconductor-generated heat tends to affect such devices negatively. Additionally, from the viewpoint of environmental problems, electric vehicles and LEDs are being developed actively. PCBs are one of the principal components for building such devices. In recent years, PCBs containing alumina fillers with high thermal conductivity have been developed and begun to be widely used. However, when processing these PCBs, the drill tools become severely worn because of the filler's high hardness. We therefore examined the drill wear characteristics. The results show the filler is the main factor that causes drill wear, while the increase in cutting force does not affect it. The cutting force increases with the drill wear linearly. Moreover, the characteristic of PCBs with higher filler content rates is close to that of inorganic material like ceramics.
AB - This paper describes micro-drilling processes for printed circuit boards (PCBs) containing fillers with high hardness and high thermal conductivity. Inspired primarily by devices such as digital cameras, laptop computers, and wireless communications devices, the electronics field today is continuously demanding smaller, lighter, and more technologically advanced high performance devices. However, that the increase in semiconductor-generated heat tends to affect such devices negatively. Additionally, from the viewpoint of environmental problems, electric vehicles and LEDs are being developed actively. PCBs are one of the principal components for building such devices. In recent years, PCBs containing alumina fillers with high thermal conductivity have been developed and begun to be widely used. However, when processing these PCBs, the drill tools become severely worn because of the filler's high hardness. We therefore examined the drill wear characteristics. The results show the filler is the main factor that causes drill wear, while the increase in cutting force does not affect it. The cutting force increases with the drill wear linearly. Moreover, the characteristic of PCBs with higher filler content rates is close to that of inorganic material like ceramics.
KW - Cutting force
KW - High hardness filler
KW - Micro-drilling
KW - Printed circuit boards
KW - Temperature
KW - Thrust
KW - Torque
UR - http://www.scopus.com/inward/record.url?scp=84869396413&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84869396413&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/AMR.565.442
DO - 10.4028/www.scientific.net/AMR.565.442
M3 - Conference contribution
AN - SCOPUS:84869396413
SN - 9783037854679
VL - 565
T3 - Advanced Materials Research
SP - 442
EP - 447
BT - Advances in Abrasive Technology XV
ER -