TY - JOUR
T1 - Improving process of surface roughness with super-soft grade resinoid bond wheel (1st report) - Minimizing phenomenon of surface roughness after starting grinding process
AU - Ohashi, Kazuhito
AU - Tada, Norihiro
AU - Nakzawa, Kazuhiko
AU - Ohkawa, Noritake
AU - Tsukamoto, Shinya
AU - Nakajima, Toshikatsu
N1 - Copyright:
Copyright 2018 Elsevier B.V., All rights reserved.
PY - 2003/6
Y1 - 2003/6
N2 - In this paper, an improving process of surface roughness in cylindrical plunge grinding with a super-soft grade resinoid bond wheel, whose bonding material is prepared by the interaction of polyvinyl alcohol and thermosetting plastics, is discussed, analyzing the ground surface profile, the topography of acting wheel surface and so on. Main conclusions obtained in this paper are as follows: (1) Minimizing phenomenon of surface roughness in which surface roughness decreases down to the minimum after start of grinding is remarkably occurred in plunge grinding process with a super-soft grade resinoid bond wheel. And the phenomenon is useful for improving surface roughness by grinding. (2) Decrease of number of simultaneously acting cutting edge by a rapid increase of wheel wear leads to worsen the surface finish just after the point of minimizing surface roughness. (3) The number of simultaneously acting cutting edge is obtained by ground surface profile, topography of acting wheel surface and interference wheel arc length.
AB - In this paper, an improving process of surface roughness in cylindrical plunge grinding with a super-soft grade resinoid bond wheel, whose bonding material is prepared by the interaction of polyvinyl alcohol and thermosetting plastics, is discussed, analyzing the ground surface profile, the topography of acting wheel surface and so on. Main conclusions obtained in this paper are as follows: (1) Minimizing phenomenon of surface roughness in which surface roughness decreases down to the minimum after start of grinding is remarkably occurred in plunge grinding process with a super-soft grade resinoid bond wheel. And the phenomenon is useful for improving surface roughness by grinding. (2) Decrease of number of simultaneously acting cutting edge by a rapid increase of wheel wear leads to worsen the surface finish just after the point of minimizing surface roughness. (3) The number of simultaneously acting cutting edge is obtained by ground surface profile, topography of acting wheel surface and interference wheel arc length.
KW - Ground surface profile
KW - Minimizing phenomenon of surface roughness
KW - Number of simultaneously acting cutting edge
KW - Super-soft grade resinoid bond wheel
KW - Surface roughness
KW - Topography of acting wheel surface
KW - Wheel wear
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U2 - 10.2493/jjspe.69.803
DO - 10.2493/jjspe.69.803
M3 - Article
AN - SCOPUS:30744471416
SN - 0912-0289
VL - 69
SP - 803
EP - 808
JO - Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
JF - Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
IS - 6
ER -