Improving process of surface roughness with super-soft grade resinoid bond wheel (1st report) - Minimizing phenomenon of surface roughness after starting grinding process

Translated title of the contribution: Improving process of surface roughness with super-soft grade resinoid bond wheel (1st report) - Minimizing phenomenon of surface roughness after starting grinding process

Kazuhito Ohashi, Norihiro Tada, Kazuhiko Nakzawa, Noritake Ohkawa, Shinya Tsukamoto, Toshikatsu Nakajima

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

In this paper, an improving process of surface roughness in cylindrical plunge grinding with a super-soft grade resinoid bond wheel, whose bonding material is prepared by the interaction of polyvinyl alcohol and thermosetting plastics, is discussed, analyzing the ground surface profile, the topography of acting wheel surface and so on. Main conclusions obtained in this paper are as follows: (1) Minimizing phenomenon of surface roughness in which surface roughness decreases down to the minimum after start of grinding is remarkably occurred in plunge grinding process with a super-soft grade resinoid bond wheel. And the phenomenon is useful for improving surface roughness by grinding. (2) Decrease of number of simultaneously acting cutting edge by a rapid increase of wheel wear leads to worsen the surface finish just after the point of minimizing surface roughness. (3) The number of simultaneously acting cutting edge is obtained by ground surface profile, topography of acting wheel surface and interference wheel arc length.

Translated title of the contributionImproving process of surface roughness with super-soft grade resinoid bond wheel (1st report) - Minimizing phenomenon of surface roughness after starting grinding process
Original languageJapanese
Pages (from-to)803-808
Number of pages6
JournalSeimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Volume69
Issue number6
DOIs
Publication statusPublished - Jun 2003
Externally publishedYes

ASJC Scopus subject areas

  • Mechanical Engineering

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