TY - CONF
T1 - Image analysis techniques for the detection of defects at BGA by x-ray
AU - Sumimoto, T.
AU - Maruyama, T.
AU - Azuma, Y.
AU - Goto, S.
AU - Mondou, M.
AU - Furukawa, N.
AU - Okada, S.
N1 - Funding Information:
The authors wish to thank Interface Corporation for providing IC test packages and Western Hiroshima Prefecture Industrial Research Institute for technical support to capture X-ray image data by using the X-ray computed tomography.
Publisher Copyright:
© 2003 Universita degli Studi di Perugia. All rights reserved.
PY - 2003
Y1 - 2003
N2 - This paper deals with the development of image analysis for the detection of defects at BGA solder joints in PC boards by using X-ray imaging. We can’t detect visually defects at BGA solder joints, because they are hidden under the IC package. To improve a cost performance and the reliability of PC boards, an inspection of BGA is required in the surface mount process. Types of defects at BGA solder joints are solder bridge, missing connection, solder voids, open connection and miss-registration of parts. As we can find mostly solder bridge in these defects, we pick up this to detect solder bridge in a production line. The problems of image analysis for the detection of defects at BGA solder joints are the detection accuracy and image processing time according to a line speed of production. To get design data for the development of the inspection system, which can be used easily in the surface mount process, it is important to develop image analysis techniques based on X-ray image data. At the first step of our study, we attempt to measure the shape of BGA based on X-ray imaging.
AB - This paper deals with the development of image analysis for the detection of defects at BGA solder joints in PC boards by using X-ray imaging. We can’t detect visually defects at BGA solder joints, because they are hidden under the IC package. To improve a cost performance and the reliability of PC boards, an inspection of BGA is required in the surface mount process. Types of defects at BGA solder joints are solder bridge, missing connection, solder voids, open connection and miss-registration of parts. As we can find mostly solder bridge in these defects, we pick up this to detect solder bridge in a production line. The problems of image analysis for the detection of defects at BGA solder joints are the detection accuracy and image processing time according to a line speed of production. To get design data for the development of the inspection system, which can be used easily in the surface mount process, it is important to develop image analysis techniques based on X-ray image data. At the first step of our study, we attempt to measure the shape of BGA based on X-ray imaging.
KW - Ball grid array
KW - Image analysis
KW - X-ray
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M3 - Paper
AN - SCOPUS:85084021796
T2 - 8th International Workshop on ADC Modelling and Testing, IWADC 2003
Y2 - 8 September 2003 through 10 September 2003
ER -