Image analysis techniques for the detection of defects at BGA by x-ray

T. Sumimoto, T. Maruyama, Y. Azuma, S. Goto, M. Mondou, N. Furukawa, S. Okada

Research output: Contribution to conferencePaper

Abstract

This paper deals with the development of image analysis for the detection of defects at BGA solder joints in PC boards by using X-ray imaging. We can’t detect visually defects at BGA solder joints, because they are hidden under the IC package. To improve a cost performance and the reliability of PC boards, an inspection of BGA is required in the surface mount process. Types of defects at BGA solder joints are solder bridge, missing connection, solder voids, open connection and miss-registration of parts. As we can find mostly solder bridge in these defects, we pick up this to detect solder bridge in a production line. The problems of image analysis for the detection of defects at BGA solder joints are the detection accuracy and image processing time according to a line speed of production. To get design data for the development of the inspection system, which can be used easily in the surface mount process, it is important to develop image analysis techniques based on X-ray image data. At the first step of our study, we attempt to measure the shape of BGA based on X-ray imaging.

Original languageEnglish
Publication statusPublished - Jan 1 2003
Event8th International Workshop on ADC Modelling and Testing, IWADC 2003 - Perugia, Italy
Duration: Sep 8 2003Sep 10 2003

Conference

Conference8th International Workshop on ADC Modelling and Testing, IWADC 2003
CountryItaly
CityPerugia
Period9/8/039/10/03

Fingerprint

Solder Joint
Image Analysis
Soldering alloys
Image analysis
Defects
X rays
X-ray Imaging
Inspection
Production Line
Voids
Registration
Image Processing
Imaging techniques
Line
Costs
Image processing

Keywords

  • Ball grid array
  • Image analysis
  • X-ray

ASJC Scopus subject areas

  • Modelling and Simulation

Cite this

Sumimoto, T., Maruyama, T., Azuma, Y., Goto, S., Mondou, M., Furukawa, N., & Okada, S. (2003). Image analysis techniques for the detection of defects at BGA by x-ray. Paper presented at 8th International Workshop on ADC Modelling and Testing, IWADC 2003, Perugia, Italy.

Image analysis techniques for the detection of defects at BGA by x-ray. / Sumimoto, T.; Maruyama, T.; Azuma, Y.; Goto, S.; Mondou, M.; Furukawa, N.; Okada, S.

2003. Paper presented at 8th International Workshop on ADC Modelling and Testing, IWADC 2003, Perugia, Italy.

Research output: Contribution to conferencePaper

Sumimoto, T, Maruyama, T, Azuma, Y, Goto, S, Mondou, M, Furukawa, N & Okada, S 2003, 'Image analysis techniques for the detection of defects at BGA by x-ray', Paper presented at 8th International Workshop on ADC Modelling and Testing, IWADC 2003, Perugia, Italy, 9/8/03 - 9/10/03.
Sumimoto T, Maruyama T, Azuma Y, Goto S, Mondou M, Furukawa N et al. Image analysis techniques for the detection of defects at BGA by x-ray. 2003. Paper presented at 8th International Workshop on ADC Modelling and Testing, IWADC 2003, Perugia, Italy.
Sumimoto, T. ; Maruyama, T. ; Azuma, Y. ; Goto, S. ; Mondou, M. ; Furukawa, N. ; Okada, S. / Image analysis techniques for the detection of defects at BGA by x-ray. Paper presented at 8th International Workshop on ADC Modelling and Testing, IWADC 2003, Perugia, Italy.
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